Telecommunications SMT Manufacturing

Telecommunications equipment combines dense digital circuits, RF modules, optical interfaces, power devices and high-density connectors. Routers and switches use BGA, QFN and fine-pitch components. Base-station and outdoor communication equipment may also contain power terminals, filters, shielding structures and through-hole connectors.
DEZ provides PCB and stencil cleaning, nozzle maintenance, reflow and selective soldering, PCBA cleaning, X-ray inspection, BGA rework and PCB handling equipment for telecommunications electronics production.
Discuss Your Telecom PCBA

Telecommunications PCB Assembly Types

Network and Data-Processing Boards

Router, switch, gateway and server-interface PCBAs containing processors, memory devices, BGA packages and high-density connectors.

RF and Radio Modules

PCB assemblies for base stations, remote radio units, antenna systems, signal amplification and frequency control.

Optical Communication Equipment

Control and interface boards for optical transceivers, fibre communication systems and network transmission equipment.

Telecom Power Systems

Power supplies, rectifiers, battery-control modules and DC distribution boards containing high-current terminals and power devices.

Outdoor Communication Equipment

PCBAs used in outdoor cabinets and base-station equipment that may require cleaning and conformal coating before final assembly.

Customer-Premises Equipment

Control boards for modems, routers, wireless access equipment and other connected communication products.

Equipment by Telecom Board Type

Telecommunications SMT FAQ

Which X-Ray Machine Inspects BGA and RF Power Devices?

Choose the DEZ-X7600. It inspects compatible BGA, QFN, LGA, CSP and exposed-pad devices on assemblies up to 510 × 450 mm and 12 kg.

Choose the DEZ-R800PC for standard continuous SMT production. Choose the DEZ-R1000PC when large copper areas, shielding or power devices require a longer heating process.

Choose the DEZ-H3600A for offline production up to 400 × 300 mm. Choose the DEZ-H3800S or DEZ-H3900A for continuous inline production.

Choose the DEZ-C743 for different products cleaned in batches. Choose the DEZ-C1520 for stable products requiring continuous washing, DI-water rinsing and drying.

Use the DEZ Dual-Rail PCB Conveyor between compatible dual-lane machines and the DEZ Dual-Lane PCB Unloader at the end of the line.

Provide the PCB dimensions, weight, component packages, shielding structures, production cycle, soldering process, flux, coating requirement and inspection target.

Request a Telecommunications SMT Solution

Send us the telecom product type, PCB specifications, component layout, production volume, soldering process, cleaning requirement and hidden-joint inspection target.

DEZ will recommend the required reflow, selective soldering, cleaning, X-ray inspection, BGA rework and handling equipment.

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