Define the PCB or workpiece, process stage and production problem first. Then confirm dimensions, contamination or soldering defects, production volume, required result and factory utilities. Then Contact us.
Yes, when the PCB dimensions, contamination, process chemistry, component clearance and production method fall within the machine’s confirmed range.
Machine dimensions, conveyor direction, working height, rail structure, process settings and selected functions can be reviewed according to the customer’s line requirements.
PCBAs, stencils, nozzles, fixtures and defective assemblies can be evaluated according to the intended cleaning, soldering, inspection or rework process.
Find equipment according to the production problem, including PCB cleaning before printing, PCBA cleaning after soldering, stencil and nozzle cleaning, selective soldering, SMT line handling, X-ray inspection and BGA rework.
Use the contact form to provide your industry, PCB or workpiece type, dimensions, current process, production problem and required throughput.
For line equipment, include the conveyor direction, working height and upstream and downstream machines. For cleaning or soldering equipment, include the contamination, solder material, process chemistry and available power, compressed air, DI water, drainage, exhaust or nitrogen.
DEZ SMT will review the information and identify the relevant equipment and process configuration.
We share our SMT manufacturing expertise to help you optimize soldering, PCBA cleaning, inspection, and production efficiency.
