Medical Device Electronics Manufacturing

Medical electronic assemblies are used in diagnostic equipment, monitoring systems, laboratory instruments, imaging systems and treatment devices. Manufacturers must control soldering parameters, post-solder residue, hidden-joint inspection, product changeovers and authorised rework. A board that looks acceptable may still contain ionic residue, hidden solder defects or an incorrectly applied process setting.
DEZ provides PCB and stencil cleaning, nozzle maintenance, reflow and selective soldering, PCBA cleaning, X-ray inspection, BGA rework and PCB handling equipment for medical electronics production.
Discuss Your Medical Electronics Process

What Medical Electronics Manufacturers Must Control

Repeatable Soldering Processes

Reflow profiles and selective-soldering programmes must be established for the actual PCB, components, solder paste and flux.

Residue Before Conformal Coating

Flux and soluble contamination may remain around solder joints or beneath components. Applying coating does not remove contamination already present on the PCBA.

Hidden BGA and QFN Connections

Processors, memory devices and control ICs often use bottom-terminated packages that cannot be inspected visually.

Controlled Product Changeovers

Different medical products must use the correct stencil, nozzle, conveyor width, soldering profile, cleaning settings and inspection programme.

Authorised Component Rework

Heating, component removal, optical alignment and replacement must be controlled to reduce pad damage, PCB warpage and heating of nearby components.

Production and Inspection Records

The manufacturer must define which process settings, inspection images and acceptance results are retained for each medical product.

Equipment by Medical Production Requirement

Medical Electronics Equipment FAQ

Which Cleaning Machine Fits High-Mix Medical Production?

Choose the DEZ-C743 when different medical PCBAs are cleaned in batches and model changes are frequent.

Choose the DEZ-C1520 when the same or similar PCBAs must pass continuously through washing, DI-water rinsing and drying.

Choose the DEZ-H3500A or H3600A for offline production. Choose the DEZ-H3800S or H3900A when automatic inline transfer is required.

Choose the DEZ-X7600 for BGA, QFN, LGA, CSP and compatible bottom-terminated components. It supports assemblies up to 510 × 450 mm and 12 kg.

Choose the DEZ-R820 for PCBs up to 415 × 370 mm and components up to 80 × 80 mm. Choose the DEZ-R880A for PCBs up to 710 × 490 mm and components up to 120 × 120 mm.

Choose the DEZ-C730 or C780 for compatible solvent-based cleaning. Choose the DEZ-C750 when automatic water-based washing, rinsing and drying are required.

Sure.

Provide the PCB dimensions, component layout, production volume, soldering process, flux, cleaning requirement, inspection target, required records and applicable customer or regulatory controls.

Request a Medical Electronics Manufacturing Solution

Send us the medical product type, PCB specifications, component layout, production method, soldering requirements, cleaning target and inspection needs.

DEZ will recommend the required offline or inline equipment and identify which processes should be tested with actual PCB samples.

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