The DEZ-H3200A automates selective flux application and mini-wave soldering of through-hole components on PCBAs up to 300 × 250 mm.
After manual loading, the XYZ platform moves each programmed soldering point between the fluxing and nitrogen-assisted soldering positions. Solder temperature, movement path, speed, nozzle height and wave parameters are controlled through the industrial PC and saved for repeated production.
The compact offline machine is suitable for manufacturers replacing hand soldering on small PCBAs or adding flexible THT soldering capacity beside an existing assembly line.
Hand soldering quality depends on the operator’s technique, solder quantity, iron temperature and contact time. Variations between operators or shifts can produce insufficient hole fill, excess solder, bridging, cold joints and damaged pads.
The H3500A controls the movement path, nozzle height, wave contact time, solder temperature and withdrawal direction for every programmed joint. Once the process is confirmed, the same parameters are applied to each PCBA.
Flux and solder are delivered only to the required through-hole joints. The complete underside of the board does not pass across a conventional solder wave, allowing THT connectors and components to be soldered close to previously reflowed SMD packages.
| Process | Function |
|---|---|
| Manual loading | The operator places the PCBA or carrier on the XYZ platform |
| Program selection | The machine loads the stored path and soldering parameters |
| Selective fluxing | The jet valve applies flux to the programmed THT areas |
| Position transfer | The XYZ platform moves the PCBA above the soldering nozzle |
| Selective soldering | Each programmed joint moves across the nitrogen-assisted mini-wave |
| Live monitoring | The camera displays the soldering process on the control screen |
| Manual unloading | The soldered PCBA is removed for inspection or the next process |
| Specification | DEZ-H3200A |
|---|---|
| Machine Dimensions | L1150 × W795 × H1550 mm |
| Total Power | 3 kW |
| Operating Power | Approximately 1 kW |
| Power Supply | Single-phase AC 220 V, 50 Hz |
| Net Weight | Approximately 300 kg |
| Maximum Soldering Area | L300 × W250 mm; custom sizes available |
| PCB Thickness | 0.2–6 mm |
| Minimum PCB Edge | ≥3 mm |
| Loading and Unloading | Manual |
| Operating Height | 700 ±30 mm |
| Bottom Component Clearance | 30 mm |
| Control System | Industrial PC |
| Motion Axes | X, Y and Z |
| Motion Control | Servo and stepper motors |
| Positioning Accuracy | ±0.1 mm |
| Flux Tank Capacity | 1 L |
| Solder Pot Quantity | One |
| Solder Pot Capacity | 15 kg |
| Solder Melting Time | 30–40 minutes |
| Maximum Solder Temperature | 350°C |
| Solder Pot Power | 1.2 kW |
| Standard Nozzles | 4 mm × 3, 5 mm × 1 and 6 mm × 1 |
| Air Pressure | 3–5 bar |
| Air Consumption | 8–12 L/min |
| Nitrogen Pressure | 3–4 bar |
| Nitrogen Purity | ≥99.998% |
| Nitrogen Consumption | 1–2 m³/h per nozzle |
We have worked with
| Selection Requirement | DEZ-H3200A | DEZ-H3500A | DEZ-H3600A |
|---|---|---|---|
| Primary Positioning | Small PCB selective soldering | Larger offline automatic soldering | Soldering with infrared preheating |
| Maximum Soldering Area | 300 × 250 mm | 350 × 410 mm | 400 × 300 mm |
| Motion Control | Servo + stepper | Stepper | Closed-loop servo |
| Positioning Accuracy | ±0.1 mm | ±0.1 mm | ±0.1 mm |
| Integrated Preheating | Not included in confirmed configuration | Not included in confirmed configuration | 3 kW lower infrared preheating |
| Loading and Unloading | Manual | Manual | Manual |
| Best Fit | Compact PCBAs and limited floor space | Larger PCBAs and wider working area | Thick boards and higher thermal-mass components |
Flux application, XYZ movement and selective soldering are automatic. PCBA loading and unloading are manual, so the H3200A is an offline automatic selective soldering machine.
It solders through-hole connectors, terminals, relays, transformers, switches, sockets and pin headers. It does not solder BGA, QFN or other surface-mount packages.
Check the solder level, pump operation, nozzle blockage, oxide buildup and nitrogen flow. A partially blocked nozzle can change the wave height during production.
Inspect the pad and lead for oxidation or contamination. Also verify flux activation, solder temperature, nitrogen purity and oxide accumulation around the nozzle.
Nitrogen purity should be at least 99.998%, with 3–4 bar pressure and consumption of approximately 1–2 m³/h per nozzle.
Nozzle selection depends on pad dimensions, pin spacing, required solder quantity, nearby SMD components and available access around the joint.
The solder pot supports temperatures up to 350°C. Confirm the alloy, pot compatibility and required temperature before changing solder materials.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
An equipment specialist will contact you within one hour during business hours.
Get a Free Recommendation and Request Sample Testing
Email: [email protected]
Phone: +86 138 2338 9052
