Automatic Water-Based Stencil Cleaning Machine | DEZ-C750

The DEZ-C750 Water-Based Stencil Cleaning Machine automatically washes, rinses and dries SMT stencils inside one enclosed cleaning chamber.

High-pressure movable spray removes solder paste, red glue, flux and other process residues from stencil surfaces and apertures. A separate rinse stage removes the cleaning chemistry, followed by heated high-pressure air drying.

The machine supports stencils and screens up to 740 × 740 × 40 mm and can also clean compatible squeegees, printing tools and fixtures.

By standardising the complete cleaning cycle, the DEZ-C750 helps manufacturers prevent blocked apertures, reduce inconsistent manual cleaning and prepare stencils for the next printing process.

Capability Customer Benefit
Automatic wash, rinse and dry Completes the entire cleaning process in one chamber
Movable high-pressure spray Reaches both stencil surfaces and fine apertures
Water-based cleaning process Reduces dependence on highly volatile solvent cleaning
Separate cleaning and rinse tanks Prevents used cleaning liquid from directly contaminating rinse water
Open- or closed-loop rinsing Adapts water use to the required cleanliness level
Three-stage filtration Removes solder paste, red glue and particles from circulated liquid
Heated air-knife drying Removes retained water before the stencil returns to production
Programmable touchscreen Repeats approved cleaning settings
304 stainless-steel chamber Resists water-based cleaning chemistry and corrosion
Resistivity monitoring Helps evaluate final rinse-water condition
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SKU: Stencil-Cleaning-Machine-C750 Category:
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Prevent Blocked Stencil Apertures

Solder paste and red glue can remain inside stencil apertures after printing. If these residues dry or accumulate, the next printing cycle may produce:

  • Incomplete solder-paste deposits
  • Unequal deposit volume
  • Missing paste
  • Poor aperture release
  • Bridging
  • Insufficient solder
  • Inconsistent printing between boards

Fine-pitch and small apertures are particularly difficult to clean manually because the stencil surface may look clean while residue remains inside the opening.

The DEZ-C750 directs cleaning liquid across both sides of the stencil using a reciprocating high-pressure spray system. The liquid passes through the apertures and removes residue from areas that cannot be reached reliably with manual wiping.

Cleaning Applications of the Stencil Cleaning Machine DEZ-C750

This is a multi-purpose stencil cleaning machine, suitable for the following applications. For routine post-solder PCBA flux cleaning, DEZ’s dedicated PCBA cleaning machines provide a more appropriate product category and process configuration.

SMT Stencil Cleaning

Remove solder paste and flux residues from framed SMT stencils between production batches and before storage.

Red Glue Stencil Cleaning

Use compatible water-based chemistry and heated spray cleaning to remove red glue from stencil surfaces and apertures.

Screen and Mesh Cleaning

Clean compatible copper mesh, screen-printing frames and mesh-based process tools within the chamber capacity.

SMT Squeegee Cleaning

Remove solder paste and printing residue from compatible squeegees without repeated manual wiping.

Printing Fixture Cleaning

Clean compatible printing fixtures, holders and production tools contaminated by solder paste, flux or adhesive.

Selected PCB or PCBA Cleaning

The chamber can process selected PCB or PCBA products only when the board, components and cleaning chemistry are compatible with high-pressure water-based spray, rinsing and heated drying.
Stenci Cleaning Machine Cleaning Process

Clean, Rinse and Dry in One Chamber

A stencil should not return to solder paste printing with cleaning-agent residue or retained rinse water. The DEZ-C750 completes three automatic stages:

1. High-Pressure Cleaning: Water-based cleaning liquid is sprayed across both sides of the stencil to dissolve and remove solder paste, red glue, flux and loose particles.

2. Clean-Water or DI-Water Rinsing: The stencil is rinsed to remove the cleaning liquid and released contamination. Rinsing can be configured for open- or closed-loop operation.

3. Heated Air Drying: A high-pressure fan and heated air-knife system remove water from the stencil surface, frame and apertures.

Process Flow: Load Stencil → Water-Based Spray Cleaning → Rinsing → Heated Air-Knife Drying → Unload

The complete cycle runs automatically after the operator loads the stencil and selects the required programme.

Stencil Cleaning Machine DEZ-C750 Technical Specifications

ParameterSpecification
Cleaning Chamber740 × 740 × 40 mm
Cleaning ProcessHigh-pressure wash, rinse and hot-air dry
Cleaning / Rinse / Dry Time2–8 minutes per stage, adjustable
Liquid TemperatureAmbient to 60°C
Liquid TanksTwo 42 L tanks
Filtration10 μm + 5 μm + 1 μm
UtilitiesAC 380 V; air 0.45–0.7 MPa; water 0.2–0.3 MPa
Total Power27 kW
Machine Dimensions1,310 × 1,410 × 1,860 mm
Machine WeightApproximately 560 kg

We are Proud to Partner with These Brands

We have worked with

DEZ-SMT-Partner-BAE-SYSTEMS DEZ-SMT-Partner-Dextra DEZ-SMT-Partner-eolane DEZ-SMT-Partner-Foxconn DEZ-SMT-Partner-IMI DEZ-SMT-Partner-JABIL DEZ-SMT-Partner-LACROIX DEZ-SMT-Partner-Laudren-Electronique DEZ-SMT-Partner-LEAB DEZ-SMT-Partner-MULTILASEr DEZ-SMT-Partner-RENISHAW DEZ-SMT-Partner-SANMINA DEZ-SMT-Partner-UNIVERSAL DEZ-SMT-Partner-Visteon

Features of the Automatic Stencil Cleaning Machine

Stencil Cleaning Machine Transmission and Motion Mechanism

Water-Based Cleaning for Solder Paste and Red Glue

The DEZ-C750 is designed to work with a compatible water-based cleaning agent.
Water-based chemistry is particularly suitable where the factory wants to remove: Solder-paste residues, Red glue, Flux residues, Rosin particles, Printing contamination, Compatible adhesive residues.
The cleaning result depends on matching the chemistry to the actual material.

Separate Cleaning and Rinse Liquids

The machine uses independent tanks for cleaning liquid and rinse water.
During cleaning, used liquid returns to the cleaning tank through the filtration system. During rinsing, a separate water supply removes cleaning-agent residue from the workpiece. The listed configuration uses two 42-litre tanks.
Stencil Cleaning Machine Cleaning and Rinsing System
Stencil Cleaning Machine Power and Energy System

Three-Stage Liquid Filtration

Solder paste, red glue and other contamination removed from the stencil enter the circulated cleaning liquid. Without filtration, these particles can return to the spray system and be deposited back onto the stencil.
Filtration supports liquid reuse while helping protect pumps, spray nozzles and cleaned workpieces from recirculated particles. The DEZ-C750 uses three filtration stages:
Filtration StageFunction
10 μm filterCaptures larger particles and loose labels
5 μm filterRemoves smaller solder paste and adhesive particles
1 μm filter elementProvides fine filtration before liquid recirculation

Programmable Automatic Operation

The operator loads the stencil, closes the chamber and selects the required cleaning programme from the touchscreen.
The machine then automatically performs liquid heating, spray cleaning, liquid recovery, rinsing, repeated rinse cycles, air drying, process completion, and system reset.
Programmed operation allows production teams to create different settings for solder paste, red glue, light contamination, dried contamination, stencils, squeegees, and printing fixtures.
Approved programmes reduce the need for operators to adjust process parameters manually for every cleaning cycle.
Stencil Cleaning Machine Stainless Steel Body and Structure

Sample Cleaning Test

DEZ can test the customer’s actual stencil, residue and cleaning chemistry before confirming the machine process.
Slide the button below to see the effect. The left side shows the stencil before cleaning, and the right side shows it after cleaning.

Work Case Reference Before Cleaning Work Case Reference After Cleaning

Industries Using Water-Based Stencil Cleaning

Water-based stencil cleaning is used across electronics manufacturing wherever solder paste, red glue and flux residues must be removed from stencil apertures before the next printing cycle.

Automotive-Electronics-SMT-1
Automotive Electronics
Fine-pitch stencils used for automotive control, sensor and power-electronics boards require consistent aperture cleaning before reuse.
Medical Device Manufacturing
Medical Electronics
Automatic wash, rinse and dry stages support controlled stencil-cleaning procedures and recorded process settings.
Telecommunications SMT 1
Telecommunications
Large and fine-pitch stencils used for networking and communication boards can be cleaned within the 740 × 740 mm chamber.
Industrial Control SMT
Industrial Control Electronics
Stencils used for mixed-size components and heavy solder deposits can be cleaned with adjustable spray, heating and cycle settings.
LED & Power Electronics
LED and Power Electronics
The machine can remove compatible solder paste and adhesive residues from stencils used for LED modules and power assemblies.
EMS & Contract Manufacturing
EMS and Contract Manufacturing
EMS factories process different solder pastes, stencil formats and production batches. Saved cleaning programmes support repeatable changeover between customer products.

Continue Your SMT Cleaning Process

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Pneumatic Stencil Cleaning Machine
Compare the automatic water-based process with a pneumatic solvent-cleaning system that requires fewer electrical and water utilities.
Solder Paste Stencil Cleaning Solutions
SMT Stencil Cleaning
Learn how residue type, aperture size, chemistry, rinsing and drying determine the correct stencil-cleaning process.

FAQs by DEZ-C750

What does the DEZ-C750 clean?

It is primarily designed for SMT stencils, red glue stencils, compatible screens, squeegees and printing fixtures.

It can remove compatible solder paste, red glue, flux, rosin and printing residues using the correct water-based cleaning chemistry.

The listed cleaning chamber is 740 × 740 × 40 mm.

Yes. Rinsing is included after the water-based cleaning stage.

Yes. The machine uses heated high-pressure air and an air-knife system.

Yes. DI water can be used for rinsing when required by the process.

The listed configuration includes resistivity monitoring up to 18 MΩ.

Yes. Cleaning liquid can be returned through the three-stage filtration system for recirculation.

Yes, when a compatible water-based cleaning agent, temperature and cleaning time are selected.

No. It uses high-pressure liquid spray, avoiding direct mechanical brush contact with the stencil.

Selected PCBAs may be compatible, but routine post-solder flux cleaning should normally use a dedicated PCBA cleaning machine.

The machine requires AC 380 V power, compressed air, water supply, drainage and an appropriate exhaust or ventilation arrangement.

Yes. Customers can send contaminated stencils, residue information and cleanliness requirements for sample testing.

Send Your SMT Equipment Requirements

Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.

Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.

An equipment specialist will contact you within one hour during business hours.

Get a Free Recommendation and Request Sample Testing
Email: [email protected]
Phone: +86 138 2338 9052

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