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The DEZ-C750 Water-Based Stencil Cleaning Machine automatically washes, rinses and dries SMT stencils inside one enclosed cleaning chamber.
High-pressure movable spray removes solder paste, red glue, flux and other process residues from stencil surfaces and apertures. A separate rinse stage removes the cleaning chemistry, followed by heated high-pressure air drying.
The machine supports stencils and screens up to 740 × 740 × 40 mm and can also clean compatible squeegees, printing tools and fixtures.
By standardising the complete cleaning cycle, the DEZ-C750 helps manufacturers prevent blocked apertures, reduce inconsistent manual cleaning and prepare stencils for the next printing process.
| Capability | Customer Benefit |
|---|---|
| Automatic wash, rinse and dry | Completes the entire cleaning process in one chamber |
| Movable high-pressure spray | Reaches both stencil surfaces and fine apertures |
| Water-based cleaning process | Reduces dependence on highly volatile solvent cleaning |
| Separate cleaning and rinse tanks | Prevents used cleaning liquid from directly contaminating rinse water |
| Open- or closed-loop rinsing | Adapts water use to the required cleanliness level |
| Three-stage filtration | Removes solder paste, red glue and particles from circulated liquid |
| Heated air-knife drying | Removes retained water before the stencil returns to production |
| Programmable touchscreen | Repeats approved cleaning settings |
| 304 stainless-steel chamber | Resists water-based cleaning chemistry and corrosion |
| Resistivity monitoring | Helps evaluate final rinse-water condition |
Solder paste and red glue can remain inside stencil apertures after printing. If these residues dry or accumulate, the next printing cycle may produce:
Fine-pitch and small apertures are particularly difficult to clean manually because the stencil surface may look clean while residue remains inside the opening.
The DEZ-C750 directs cleaning liquid across both sides of the stencil using a reciprocating high-pressure spray system. The liquid passes through the apertures and removes residue from areas that cannot be reached reliably with manual wiping.
This is a multi-purpose stencil cleaning machine, suitable for the following applications. For routine post-solder PCBA flux cleaning, DEZ’s dedicated PCBA cleaning machines provide a more appropriate product category and process configuration.

A stencil should not return to solder paste printing with cleaning-agent residue or retained rinse water. The DEZ-C750 completes three automatic stages:
1. High-Pressure Cleaning: Water-based cleaning liquid is sprayed across both sides of the stencil to dissolve and remove solder paste, red glue, flux and loose particles.
2. Clean-Water or DI-Water Rinsing: The stencil is rinsed to remove the cleaning liquid and released contamination. Rinsing can be configured for open- or closed-loop operation.
3. Heated Air Drying: A high-pressure fan and heated air-knife system remove water from the stencil surface, frame and apertures.
Process Flow: Load Stencil → Water-Based Spray Cleaning → Rinsing → Heated Air-Knife Drying → Unload
The complete cycle runs automatically after the operator loads the stencil and selects the required programme.
| Parameter | Specification |
|---|---|
| Cleaning Chamber | 740 × 740 × 40 mm |
| Cleaning Process | High-pressure wash, rinse and hot-air dry |
| Cleaning / Rinse / Dry Time | 2–8 minutes per stage, adjustable |
| Liquid Temperature | Ambient to 60°C |
| Liquid Tanks | Two 42 L tanks |
| Filtration | 10 μm + 5 μm + 1 μm |
| Utilities | AC 380 V; air 0.45–0.7 MPa; water 0.2–0.3 MPa |
| Total Power | 27 kW |
| Machine Dimensions | 1,310 × 1,410 × 1,860 mm |
| Machine Weight | Approximately 560 kg |
We have worked with



| Filtration Stage | Function |
|---|---|
| 10 μm filter | Captures larger particles and loose labels |
| 5 μm filter | Removes smaller solder paste and adhesive particles |
| 1 μm filter element | Provides fine filtration before liquid recirculation |

DEZ can test the customer’s actual stencil, residue and cleaning chemistry before confirming the machine process.
Slide the button below to see the effect. The left side shows the stencil before cleaning, and the right side shows it after cleaning.
Water-based stencil cleaning is used across electronics manufacturing wherever solder paste, red glue and flux residues must be removed from stencil apertures before the next printing cycle.
It is primarily designed for SMT stencils, red glue stencils, compatible screens, squeegees and printing fixtures.
It can remove compatible solder paste, red glue, flux, rosin and printing residues using the correct water-based cleaning chemistry.
The listed cleaning chamber is 740 × 740 × 40 mm.
Yes. Rinsing is included after the water-based cleaning stage.
Yes. The machine uses heated high-pressure air and an air-knife system.
Yes. DI water can be used for rinsing when required by the process.
The listed configuration includes resistivity monitoring up to 18 MΩ.
Yes. Cleaning liquid can be returned through the three-stage filtration system for recirculation.
Yes, when a compatible water-based cleaning agent, temperature and cleaning time are selected.
No. It uses high-pressure liquid spray, avoiding direct mechanical brush contact with the stencil.
Selected PCBAs may be compatible, but routine post-solder flux cleaning should normally use a dedicated PCBA cleaning machine.
The machine requires AC 380 V power, compressed air, water supply, drainage and an appropriate exhaust or ventilation arrangement.
Yes. Customers can send contaminated stencils, residue information and cleanliness requirements for sample testing.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
An equipment specialist will contact you within one hour during business hours.
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Phone: +86 138 2338 9052