BGA Rework Stations for PCB Assembly Repair

Repair the Defective Component Instead of Scrapping the PCBA

A completed PCB assembly may contain hundreds of correctly installed components but fail because of one processor, memory device, controller, FPGA, QFN or BGA package. A controlled PCB BGA rework process allows the affected component to be removed and replaced without automatically discarding the complete assembly.

This is especially valuable for expensive PCBAs, prototype boards, low-volume industrial electronics, imported control boards, obsolete assemblies and products containing high-cost semiconductor devices.

BGA rework is not simply a matter of heating the top of the component. A reliable process must control how the board is preheated, how the solder reaches reflow temperature, how the component is lifted, how the pads are prepared and how the replacement component is aligned and installed.

Choose the Right BGA Rework Station

1. Semi-Automatic Optical BGA Rework Station – DEZ-R820

The DEZ-R820 is designed for standard PCB assembly repair, mixed-product rework, engineering laboratories and lower-volume production environments.

It combines upper and lower hot-air heating with infrared preheating, CCD optical alignment, automatic component placement and profile-based heating. Its adjustable PCB support fixture accommodates different board formats while providing clearance for compatible bottom-side components.

Choose this semi-automatic BGA rework station when your PCB and component dimensions fit its working range and you need controlled BGA removal, optical alignment and component replacement without the additional motion automation required for larger or frequently repeated jobs.

The DEZ-R820 is suitable for compatible BGA, QFN, CSP, QFP, sockets and other SMD packages. It supports PCBs from 65 × 65 mm to 415 × 370 mm and components from 2 × 2 mm to 80 × 80 mm.

2. Automatic BGA Rework Station – DEZ-R880A

The DEZ-R880A is intended for larger PCB assemblies, larger component packages, repeated product batches and applications requiring more electrically controlled movement.

Its seven-axis electric motion, 1080P optical alignment, servo-controlled placement, electric component rotation and three-zone heating system reduce the number of manual adjustments required during alignment and placement.

Choose this automatic BGA rework station when you need to process large boards, move between multiple repair positions, handle larger BGA packages or improve repeatability across recurring rework jobs.

The DEZ-R880A supports compatible BGA, CSP, POP, QFN, QFP, LED and Micro-SMD components. It accommodates PCBs up to 710 × 490 mm and components up to 120 × 120 mm.

Connect BGA Rework with X-Ray Inspection

A BGA rework station repairs a component, but it does not directly inspect every solder joint beneath the installed package. X-ray inspection and BGA rework perform different functions within the same repair process.

The PCBA X-Ray Inspection System for BGA and Hidden Solder Joints – DEZ-X7600 can be used to examine hidden joint conditions before rework. This helps avoid removing a component based only on external appearance or an uncertain electrical symptom.

After component replacement, the assembly can return to X-ray inspection to evaluate solder distribution, alignment and visible internal abnormalities. Electrical and functional testing should then confirm whether the repaired board performs as intended.

Recommended workflow:

DEZ-X7600 PCBA X-Ray Inspection → DEZ BGA Rework Station → Post-Rework X-Ray and Functional Verification

Learn more about the complete X-Ray Inspection and BGA Rework process.

BGA Rework Applications

BGA rework stations can recover PCBAs rejected during AOI, X-ray, electrical or functional testing when the defect is repairable. They can also replace components during prototype development, engineering changes, product validation and new-product introduction.

For EMS and contract electronics manufacturing, flexible rework equipment supports different customer boards, package types and production batches.

In automotive electronics manufacturing, controlled rework can be used for compatible control, sensor, infotainment and power-electronics assemblies containing valuable BGA or QFN devices.

Telecommunications electronics manufacturing frequently involves large multilayer boards, processors, FPGAs and high-density packages that require effective bottom preheating and controlled component placement.

For industrial control electronics, BGA rework can help recover high-value controllers, drives and communication boards that may be expensive or difficult to replace.

BGA Rework Station FAQs

Why is bottom preheating important?

Bottom preheating warms a wider PCB area before local reflow. This helps manage boards with high thermal mass and reduces the temperature difference between the target area and the surrounding assembly.

Can the machine process lead-free solder?

A suitable temperature profile can be developed for compatible lead-free or leaded solder processes. The profile must consider the solder alloy, board construction, package limits and nearby heat-sensitive components.

Why is X-ray inspection recommended?

The solder joints beneath BGA, QFN and similar packages cannot be completely evaluated through external visual inspection. X-ray imaging helps confirm the original defect and evaluate hidden joints after replacement.

Can DEZ test a customer’s PCB before purchase?

Yes. Provide representative PCB assemblies, replacement components, package information and defect details. Sample testing helps evaluate machine fit, component access, nozzle requirements and the proposed rework process.

Find the Right BGA Rework Station for Your PCBA

Tell us about your PCB, component and current repair process. DEZ will review the application and recommend a suitable equipment configuration.