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Remove flux residue, ionic contamination and loose solder balls from assembled PCBAs after soldering. View the PCBA cleaning equipment below.
The correct equipment depends on where the contamination is located, whether mechanical contact is acceptable and how the cleaning operation must fit production.
| Production Requirement | Cleaning Route | DEZ Equipment |
|---|---|---|
| Visible flux marks or loose solder balls concentrated on one accessible solder side | Single-side brush cleaning | Automatic Single-Sided PCBA Cleaning Machine DEZ-C758 or Automatic PCBA Brush Cleaning Machine DEZ-C760 |
| Different PCBAs processed together through washing, rinsing and drying | Offline batch aqueous cleaning | Offline PCBA Cleaning Machine for Batch Flux Removal DEZ-C743 |
| PCBAs must move continuously through a complete aqueous process | Inline aqueous cleaning | Inline Water-Based PCBA Cleaning Machine DEZ-C1360 |
| The aqueous cleaner requires a dedicated DI rinse-water source | DI-water production | Deionized Water System for PCBA Cleaning DEZ-CS300 |
C758 and C760 both require direct brush access to the contaminated surface. C758 uses wet brushing, dry brushing and fan drying, while C760 uses one rotary brush and two roller brushes. Final selection should be based on PCBA dimensions, component clearance, board-edge access and a representative sample.
Brush cleaning targets contamination that can be physically reached. It must not be presented as full-board aqueous cleaning or as proof that an ionic-cleanliness requirement has been met.
Cleaning-Agent Application → Mechanical Brushing → Residue Removal and Drying
The brushes contact one accessible solder-side surface to remove visible flux marks, loose solder balls and surface debris. Component layout, protruding leads and board-edge clearance determine whether mechanical brushing is suitable.
Load → Chemical Spray Wash → DI-Water Rinse → Hot-Air Dry
The C743 holds multiple PCBAs in a two-level basket inside an enclosed chamber. The batch remains inside the machine throughout washing, rinsing and drying, making the process suitable for high-mix production that does not require continuous line integration.
Chemical Wash → DI-Water Rinse → Hot-Air Dry
The C1360 moves PCBAs continuously through separate process sections. Conveyor speed, cleaning chemistry, spray conditions, rinsing and drying must be configured around the actual flux, assembly construction and required production rate.
DI water performs the rinsing stage after chemical washing. It should not be described as the primary cleaning process.
| Information to Provide | Why It Is Required |
|---|---|
| PCBA dimensions | Confirms conveyor, basket or chamber compatibility |
| Contamination photographs | Shows its location and whether it is accessible |
| Flux and process chemistry | Determines cleaning-agent compatibility |
| Component layout | Identifies areas that may be difficult to wash or brush |
| Minimum component standoff | Affects fluid access beneath low-clearance components |
| Required cleaning result | Defines whether visible residue removal or measured cleanliness is required |
| Production quantity and takt requirement | Determines batch or continuous production needs |
| Upstream and downstream processes | Confirms whether inline integration is required |
| Available factory utilities | Confirms power, DI water, drainage, compressed air and exhaust requirements |
When the cleaning route has not already been established, representative PCBAs can be reviewed and tested before the final machine configuration is confirmed.
For brush cleaning, testing determines whether the contamination can be reached without applying unsuitable mechanical contact to the assembly. For aqueous cleaning, testing evaluates the proposed chemistry, washing, rinsing and drying conditions against the actual flux, materials and component layout.
A visually clean PCBA does not automatically meet an ionic-cleanliness requirement. When measured cleanliness is required, the customer’s test method and acceptance limit must be agreed before process confirmation.
PCBA cleaning is normally evaluated after soldering and before a downstream operation that requires a defined level of board cleanliness:
Reflow, Wave or Selective Soldering → PCBA Cleaning → Inspection, Conformal Coating or Downstream Assembly
Typical cases include mixed SMT/THT assemblies after wave or selective soldering, PCBAs requiring post-reflow residue removal and assemblies prepared for conformal coating. The flux system, assembly construction and customer requirement determine whether cleaning is necessary; soldering alone does not automatically mean every PCBA requires aqueous washing.
Read more about PCBA flux residue and ionic contamination cleaning, choosing a PCBA cleaning process after soldering and inline versus offline PCBA cleaning machines.
These processes are used for assemblies produced in automotive electronics, EMS and contract manufacturing and other electronics-production environments.
Batch and inline aqueous cleaners can require a controlled DI-water supply after the chemical-washing stage.
The DEZ-CS300 Deionized Water System combines RO and mixed-bed purification in one enclosed cabinet. Its suitability must be calculated from the cleaning machine’s rinse-water demand and the incoming-water condition rather than selected independently.
Can the same cleaning process remove every type of flux?
No. The cleaning chemistry and process conditions must be compatible with the actual flux, PCB materials, component packages and coatings. Provide the flux information and a representative assembly before the cleaning recipe is confirmed.
Does no-clean flux always need to be removed?
No-clean flux can remain when the soldering process and product requirement have been validated for it. Cleaning may still be required before conformal coating, for cosmetic acceptance, after process changes or when the customer specifies a cleanliness limit.
Can brush cleaning confirm ionic cleanliness?
No. Brush cleaning can remove reachable visible residue and loose solder balls, but appearance does not measure ionic contamination. A defined test method is required when ionic cleanliness is part of the acceptance requirement.
Can aqueous cleaning remove residue underneath components?
That depends on component standoff, board layout, flux chemistry, spray or fluid access and the required result. Low-clearance components are an important reason to review and test the actual PCBA before confirming the process.
What utilities does a PCBA cleaning machine require?
Requirements vary by model. Aqueous systems can require compatible cleaning chemistry, DI water, drainage, exhaust and model-specific electrical power. Brush machines may require cleaning fluid, compressed air and exhaust or waste collection. Confirm the installation conditions before ordering.
Do not select a PCBA cleaning machine only from its external dimensions or stated capacity.
Send DEZ a representative PCBA or contamination photographs together with the board dimensions, flux information, required cleaning result and production quantity. DEZ will review the applicable cleaning process, equipment model and factory utility requirements.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
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