The DEZ-C760 removes accessible solder balls, flux marks and surface contamination from the solder side of PCB assemblies.
It applies alcohol-based cleaning fluid to the processing surface before cleaning the PCBA with one 360 mm rotary brush and two roller brushes. The machine processes PCBAs up to 300 × 300 mm.
Automatic Cleaner Application | Rotary Brush | Two Roller Brushes
The DEZ-C760 combines conveyor transport, automatic cleaning-fluid application and mechanical brush cleaning.
A movable gripping mechanism carries the PCBA through the cleaning section. The rotary brush and two roller brushes contact the accessible solder-side surface from different directions.
The standard machine processes PCB assemblies with maximum dimensions of 300 × 300 mm. The PCBA must have a board edge of at least 1.5 mm for gripping and transport.
| Parameter | DEZ-C760 |
|---|---|
| Machine type | Automatic PCBA brush cleaning machine |
| Cleaning side | Accessible solder-side surface |
| Cleaning method | Movable gripping with rotary and roller brushes |
| Maximum PCBA dimensions | L300 × W300 mm |
| Required board edge | At least 1.5 mm |
| Machine dimensions | L2300 × W900 × H1800 ±2 mm |
| Cleaning-fluid type | Alcohol-based PCBA cleaning fluid |
| Application roller diameter | 100 mm |
| Rotary brush diameter | 360 mm |
| Main spindle speed | 0–500 rpm, adjustable |
| Conveyor speed | 0.05–1.8 m/min, continuously adjustable |
| Board loading height | 800 ±2 mm |
| Board unloading height | 920 ±2 mm |
| Power supply | AC 220 V, 50 Hz |
| Total power | 0.9 kW |
| Waste collection | Lower filter box |
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It removes accessible loose solder balls, visible flux marks and surface contamination from the solder side of a PCBA.
No. It is designed for brush cleaning of one accessible processing surface.
No. The C760 applies alcohol-based cleaning fluid before mechanical brush cleaning. It does not use a DI-water rinse stage.
No hot-air drying stage is specified for the C760.
The maximum specified board size is 300 × 300 mm.
The movable gripping mechanism requires an available edge of at least 1.5 mm to hold and transport the assembly.
No. Brush cleaning only removes solder balls that can be reached directly from the processing surface.
Yes, when the solder-side leads, components and board edges are compatible with the gripping and brush-cleaning system.
Yes. The main spindle speed is adjustable from 0 to 500 rpm.
Yes. Transport speed is adjustable from 0.05 to 1.8 m/min.
The specified cleaning agent is an alcohol-based PCBA cleaning fluid. Compatibility must be tested with the actual flux, component materials and PCB assembly.
Yes. Send sample boards, contamination photographs, board dimensions and available transport-edge information for testing.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
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