Manual wiping can remove visible contamination from open surfaces, but it cannot consistently control cleaning chemistry, rinsing quality or contamination underneath components.
The DEZ-C743 processes multiple SMT, THT or mixed-technology assemblies in one batch. Chemical spray washing, DI-water rinsing and hot-air drying are completed inside the same enclosed chamber without transferring the PCBAs between stages.
It is designed for high-mix, small- to medium-volume production that requires a complete aqueous cleaning process but does not need a large inline system.
| Key Parameter | DEZ-C743 |
|---|---|
| Cleaning method | Batch spray cleaning |
| Complete process | Chemical wash, DI rinse and hot-air drying |
| Basket size | 610 mm (L) × 560 mm (W) × 100 mm (H), double-layer |
| Maximum batch load | 10 kg |
| Wash temperature | 25–75°C |
| Maximum drying temperature | 99°C |
| Machine material | SUS304 stainless steel |
The C743 removes compatible water-soluble flux, rosin flux, selected no-clean flux residue, solder paste residue, fingerprints, dust and loose particles from assembled circuit boards.
Upper, middle and lower spray positions direct heated cleaning liquid towards both loading levels. DI water then rinses away dissolved residue and remaining cleaning agent before hot-air drying.
It can process SMT, THT and mixed-technology assemblies after reflow, wave, selective or manual soldering.
| Parameter | DEZ-C743 |
|---|---|
| Machine dimensions | 1200 mm (L) × 1100 mm (W) × 1830 mm (H) |
| Cleaning chamber | 690 mm (L) × 620 mm (W) × 715 mm (H) |
| Washing basket | 610 mm (L) × 560 mm (W) × 100 mm (H) |
| Basket configuration | Double-layer |
| Maximum product height | 100 mm |
| Maximum batch load | 10 kg |
| Machine weight | Approx. 600 kg |
| Installed power | Approx. 24 kW |
| Power supply | AC 380 V, 50 Hz, 65 A |
| Air pressure | 0.45–0.70 MPa |
| Spray pressure | 30–40 psi |
| DI-water resistivity | More than 15 MΩ·cm |
| DI-water inflow | 0.3 m³/h |
| Wash temperature | 25–75°C |
| Maximum drying temperature | 99°C |
| Cleaning time | 1–99 minutes |
| Rinsing time | 1–99 minutes |
| Drying time | 1–99 minutes |
| Chemical filtration | 0.45 μm |
| DI-water discharge filtration | 0.45 μm |
| Machine material | SUS304 stainless steel |
| Basket material | SUS304 stainless steel |
| Control system | PLC and colour touchscreen |
| Noise level | Less than 70 dB |
| Automatic liquid filling | Optional |
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It cleans compatible flux residue, solder paste residue, electroplating salts, fingerprints, dust and loose particles from assembled circuit boards.
Yes. Spray arms are positioned above, between and below the two-level basket to direct liquid towards PCBAs on both loading levels.
Yes. It can clean compatible residue from THT assemblies after wave or selective soldering, including contamination around accessible leads and solder joints.
Some no-clean flux residues can be removed using a compatible cleaning agent and validated process settings. Sample testing is required because no-clean flux formulations differ.
The quantity depends on each board’s dimensions and loading arrangement. The basket measures 610 × 560 × 100 mm and supports a combined product weight of up to 10 kg.
Yes. DI water is used during the rinsing stage. The specified inlet requirement is 0.3 m³/h with resistivity above 15 MΩ·cm.
Yes. Washing time, rinsing time, drying time and temperature settings can be adjusted through the touchscreen.
Installation requires AC 380 V power, compressed air, DI water, drainage and an exhaust connection.
Yes. The automatic filling system is available as an optional configuration.
Yes. Send the sample boards, flux information, contamination photographs and acceptance requirements. DEZ can establish and verify the cleaning process using the actual assembly.
Send your PCBA dimensions, component height, batch quantity, flux type and required cleaning result. DEZ will confirm the basket loading method, cleaning process, utilities and machine configuration.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
An equipment specialist will contact you within one hour during business hours.
Get a Free Recommendation and Request Sample Testing
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Phone: +86 138 2338 9052
