PCB cleaning usually refers to cleaning bare boards before solder paste printing. PCBA cleaning processes assembled boards after soldering to remove compatible flux residue, loose solder balls or ionic contamination.
Use the DEZ-C753S Double-Sided PCB Cleaning Machine to remove dust, fibres and loose particles from both sides of bare PCBs before solder paste printing.
Use the DEZ-C758 or DEZ-C760 for continuous brush cleaning of visible flux marks and loose solder balls from an accessible solder side.
Use the DEZ-C743 Offline PCBA Batch Cleaner for water-based washing, DI-water rinsing and hot-air drying of multiple PCBAs in one batch.
Use the DEZ-C1360 or DEZ-C1520 Inline Water-Based PCBA Cleaning Machine when assemblies must pass continuously through washing, DI-water rinsing and drying sections.
No. In water-based cleaning, compatible cleaning chemistry removes the contamination. DI water rinses dissolved residue and remaining cleaning agent from the assembly.
Some no-clean flux residues can be removed with compatible cleaning chemistry. The flux, PCB materials, component clearances and required cleanliness should be tested before confirming the process.
Ionic cleanliness must be verified using the customer’s specified test method and acceptance limit. Visual inspection alone cannot confirm ionic contamination levels.
The DEZ-C730 and DEZ-C780 Pneumatic Stencil Cleaning Machines use compatible solvent cleaning, filtration and compressed-air drying.
The DEZ-C750 completes water-based cleaning, DI-water rinsing and hot-air drying in one cycle.
The DEZ-C700 SMT Nozzle Cleaning Machine removes internal and external contamination that reduces vacuum pickup. It cannot repair worn, cracked or deformed nozzles.
The DEZ-C756 SMT Fixture Cleaning Machine cleans compatible wave-soldering pallets, selective-soldering fixtures, reflow carriers, trays and squeegees.
Selective soldering is used when only specified THT joints require soldering or when heat-sensitive and SMT components prevent the complete assembly from passing through wave soldering.
Use the DEZ-H3200A for smaller PCBs and lower-volume THT soldering. The DEZ-H3500A and DEZ-H3600A are offline systems. The DEZ-H3800S and DEZ-H3900A are intended for inline production.
Provide the PCB or carrier dimensions, THT solder-joint coordinates, bottom-side clearance, solder alloy, flux, nozzle requirements, production cycle and conveyor direction.
Nitrogen requirements depend on the soldering module, solder alloy, process settings and required solder-joint result. Nitrogen supply and consumption are confirmed with the selected configuration.
Applicable systems can be configured for the specified solder alloy. The solder pot, nozzle, temperature range and process settings must be confirmed before ordering.
The DEZ-X7600 can inspect hidden solder structures for voids, bridges, insufficient solder and package misalignment in BGA, QFN, LGA and CSP assemblies.
No. X-ray inspection examines internal structures. Electrical and functional testing are still required where specified by the production standard.
X-ray equipment identifies hidden solder-joint defects. The DEZ-R820 and DEZ-R880A remove, align and replace defective BGA, QFN, CSP and related packages.
Yes. PCBAs, stencils, fixtures and soldering samples can be evaluated to confirm the process and machine configuration.
Workpiece capacity, baskets, fixtures, conveyor direction, interfaces and selected functions can be modified after engineering review.
Standard equipment handling time is normally 7–30 days. The confirmed schedule depends on the model, configuration and custom engineering.
Pricing depends on the machine model, standard configuration, optional functions, custom requirements, packaging and delivery terms.
Conformity documents are model-specific. The applicable CE, EMC, electrical safety and RoHS documentation should be confirmed for the selected machine and destination.
Send the equipment type, workpiece dimensions, process problem, required throughput, factory utilities, destination and requested custom functions.
Send your PCB or workpiece dimensions, current production problem, required throughput and available factory utilities.
For cleaning projects, include the contamination and required cleaning result. For selective soldering projects, include the PCB drawing, THT solder-joint positions, solder alloy and flux information.
Phone: +86 138 2338 9052
Email: [email protected]
Address: 4th Floor, Building A, Hedong Industrial Zone, Xixiang, Bao’an District, Shenzhen 518126, China
