Find SMT Equipment by Production Problem

Dust before printing, blocked stencil apertures, unstable nozzle pickup, inconsistent THT soldering, flux residue and hidden BGA defects require different equipment and processes.
Explore the production stage where the problem occurs, understand the available process and compare the relevant DEZ SMT equipment.

Explore Applications by Process Stage

PCB Surface Cleaning Before Solder Paste Printing
PCB Surface Cleaning Before Printing
Dust, fibres and static-attracted particles on bare PCBs can enter the solder paste printing process. Double-sided PCB cleaning removes loose contamination before the board reaches the printer.
Solder Paste Stencil Cleaning Solutions
Solder Paste Stencil Cleaning
Solder paste, red glue and flux can dry inside stencil apertures and affect paste transfer. Pneumatic and water-based cleaning processes remove compatible residue from SMT stencils and screen mesh.
SMT-Nozzle-Cleaning-&-Placement-Accuracy
SMT Nozzle Cleaning and Maintenance
Dust and adhesive inside placement nozzles reduce vacuum pickup force and can cause mispicks or dropped components. Automatic nozzle cleaning removes contamination from the nozzle air path.
SMT Line Handling Buffering & PCB Transfer
SMT Line Handling, Buffering and Transfer
PCB loaders, unloaders, conveyors and buffers control board movement between SMT processes. Equipment selection depends on PCB dimensions, line height, direction, takt time and required buffer capacity.
Selective Soldering Defect Reduction Solutions
Selective Soldering Optimization
Connectors, terminals, relays and other THT components may require soldering without exposing the entire assembly to a conventional solder wave. Selective soldering controls flux application, preheating and mini-wave soldering at programmed joints.
PCBA Flux Residue and lonic Contamination Cleaning
PCBA Flux and Ionic Contamination Cleaning
Compatible flux and ionic residue can remain after soldering. Brush, batch and inline cleaning processes are available according to the accessible board surface, contamination, production volume and required rinse process.
X-Ray Inspection & BGA Rework Solutions
X-Ray Inspection and BGA Rework
X-ray inspection detects voids, bridges, insufficient solder and misalignment beneath BGA, QFN, LGA and other bottom-terminated components. BGA rework equipment then provides controlled heating and optical alignment for component replacement.

Main SMT Equipment Categories

View dry ice cleaning machines, fixture cleaning machines, reflow ovens, DI-water systems and other supporting SMT equipment.

FAQs for SMT Application

How do I find the correct equipment for my application?

Start with the production problem and the process stage where it occurs. Then confirm the PCB or workpiece dimensions, contamination or defect, production volume, required process result and available factory utilities.

PCB cleaning on this website refers to removing dust, fibres and static from bare boards before solder paste printing. PCBA cleaning refers to cleaning assembled circuit boards, normally after soldering.

Use an inline machine when PCBAs must move continuously through separate washing, DI-water rinsing and drying sections. Use an offline batch machine when different PCBAs are loaded into a basket and processed together.

Selective soldering is used when only programmed through-hole joints must be soldered or when the complete PCB assembly should not pass over a conventional solder wave.

SMT Equipment Solutions by Industry

Explore Applications by Industry

PCB assembly processes vary with board design, component types, production volume and reliability requirements. Explore how PCB cleaning, selective soldering, stencil cleaning, X-ray inspection, BGA rework and SMT line handling are used across different electronics manufacturing industries.

Send Your Process Information

Use the contact form to send PCB drawings, sample photos, contamination details, soldering defects or production-line information.

Include the maximum and minimum workpiece dimensions, required throughput, current process, expected result and available power, compressed air, DI water, drainage, exhaust or nitrogen supply where relevant.

DEZ SMT will review the application and identify the appropriate cleaning, soldering, inspection, rework or handling process.

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