The DEZ-X7600 PCBA X-Ray Inspection System uses high-resolution X-ray imaging to examine solder joints and internal structures that are hidden beneath electronic components.
It allows quality engineers to inspect BGA, QFN, LGA, CSP, semiconductor and other bottom-terminated components without cutting, opening or damaging the PCB assembly.
The 130 kV closed microfocus X-ray source, 5 μm focal spot and up to 150× geometric magnification reveal internal solder distribution, component position and connection conditions in real time.
By finding hidden defects before products leave the factory, the DEZ-X7600 helps manufacturers reduce repeated failures, prevent defective assemblies from reaching the next process and identify the real cause of soldering problems.
| Inspection Capability | Problem It Helps Identify |
|---|---|
| Hidden solder-joint imaging | Defects beneath BGA, QFN, LGA and CSP packages |
| High-resolution magnification | Small solder balls, fine-pitch joints and internal structures |
| Oblique-angle inspection | Overlapping joints that are difficult to separate in a vertical image |
| Real-time image display | Rapid defect confirmation during inspection |
| Void-area calculation | Excessive voiding within solder joints or thermal pads |
| Distance and size measurement | Solder-ball diameter, spacing and defect dimensions |
| Large inspection platform | PCBs and assemblies up to 510 × 450 mm |
| 12 kg platform capacity | Large or heavy electronic assemblies |
| Image and result storage | Quality records, failure analysis and process comparison |
| Non-destructive inspection | Preserves the assembly for rework or further testing |
AOI and visual inspection can examine component position, polarity and visible solder fillets. They cannot directly see solder joints located underneath a BGA, QFN or other bottom-terminated package.
A board can therefore appear correct from the outside while containing defects such as: Solder bridging, Missing solder balls, Insufficient solder, Excessive solder, Solder voids, Component misalignment, Uneven solder-ball shape, Open-joint indications, Foreign material, Internal package damage.
The DEZ-X7600 transmits X-rays through the assembly and converts differences in material density into a visible image. Solder absorbs more X-ray energy than the surrounding PCB and component materials, allowing hidden solder joints to appear clearly on the inspection screen.
This gives quality engineers direct visual evidence instead of relying only on electrical symptoms or external appearance.
Traditional destructive analysis may require cutting the PCB, removing a component or preparing a cross-section.
These methods can provide detailed evidence, but the inspected board can no longer be returned directly to production.
The X-ray component counter does not need to unwind the tape. Operators place the complete reel inside the machine and receive the count from a single scan.
The DEZ-X7600 performs non-destructive inspection through the complete assembly. The PCBA remains intact and non-destructive X-ray inspection is particularly valuable for high-cost PCBAs, low-volume products, engineering samples and assemblies containing expensive semiconductors.
| Parameter | Specification |
|---|---|
| Brand | Hamamatsu, Japan |
| Type | Closed microfocus X-ray tube |
| Maximum voltage | 130 kV |
| Current | 10–300 μA |
| Focus size | 5 μm |
| Maximum power | 39 W |
| Geometric magnification | Up to 150× |
| Parameter | Specification |
|---|---|
| Brand | iRAY |
| Detector type | Amorphous-silicon flat-panel detector |
| Imaging area | 130 × 130 mm |
| Pixel matrix | 1536 × 1536 |
| Pixel size | 85 μm |
| Resolution | 5.8 lp/mm |
| Frame rate | 20 fps |
| Viewing angle | Multi-angle inspection supported |
| Parameter | Specification |
|---|---|
| Loading area | 520 × 520 mm |
| Maximum inspection area | 510 × 450 mm |
| Maximum sample weight | 12 kg |
| X-axis travel | 510 mm |
| Y-axis travel | 450 mm |
| Detector Z-axis travel | 300 mm |
| X-ray source Z-axis travel | 300 mm |
| Control method | Joystick, mouse and keyboard |
| Navigation | High-definition camera |
| Parameter | Specification |
|---|---|
| Machine dimensions | 1,400 × 1,350 × 1,750 mm |
| Machine weight | Approximately 1,650 kg |
| Power supply | AC 220 V, 50 Hz |
| Maximum power | 2.0 kW |
| Industrial computer | Advantech industrial computer |
| Processor | Intel i5-7700 |
| Memory | 8 GB RAM |
| Storage | 1 TB HDD |
| Monitor | 24-inch FHD display |
| Listed radiation leakage | Below 0.5 μSv/h |
| Inspection Requirement | X-Ray Inspection | AOI |
|---|---|---|
| Visible component position | Yes | Yes |
| Visible solder fillets | Yes | Yes |
| Joints beneath BGA | Yes | No |
| QFN thermal-pad voids | Yes | No |
| Internal solder distribution | Yes | No |
| Component labels and polarity | Limited | Yes |
| Surface contamination | Limited | Yes |
| Internal package structure | Yes | No |
| Primary strength | Hidden and internal defects | Visible surface defects |
We have worked with
It can inspect PCBA, PCB assemblies, BGA and QFN solder joints, semiconductor packages, connectors and other compatible electronic components.
BGA solder joints are located completely underneath the package and cannot be inspected directly by AOI or visual inspection.
It can help identify voids, solder bridges, missing solder, insufficient solder, irregular joints, package displacement and other internal abnormalities.
No. It is a non-destructive inspection method, so the assembly remains intact after inspection.
Yes. The software includes image calculation and measurement functions for evaluating void areas and other visible features.
The maximum listed inspection range is 510 × 450 mm.
The inspection platform supports samples weighing up to 12 kg.
Yes. The large platform and movable inspection range allow different areas of a large assembly to be positioned for inspection.
Yes. Multi-angle observation helps separate overlapping structures and examine hidden joints from different directions.
The system provides up to 150× geometric magnification.
The DEZ-X7600 is an offline inspection system operated by an inspector. For automatic 100% production-line inspection, an inline AXI system should be evaluated.
No. AOI is better for visible component and surface defects, while X-ray is used for hidden and internal structures. The two systems perform different inspection functions.
Yes. It can inspect the solder joints after BGA removal, rebelling or replacement to verify the rework result.
Yes. Customers can provide PCBAs or electronic components for sample imaging and defect-analysis testing.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
An equipment specialist will contact you within one hour during business hours.
Get a Free Recommendation and Request Sample Testing
Email: [email protected]
Phone: +86 138 2338 9052
