PCB X-Ray Inspection Systems for Hidden Solder Defects

Find BGA Defects Before Removing the Component

A PCBA can pass visual inspection while still containing hidden solder bridges, voids, insufficient solder, missing connections or package misalignment. These defects may appear only during electrical testing, functional testing or product use.

X-ray imaging allows the inspector to examine differences in solder shape and density beneath the component. This provides physical evidence before a BGA is removed and helps determine whether rework should proceed.

Choose the System for Your Actual Task

1. PCBA X-Ray Inspection System for BGA and Hidden Solder Joints – DEZ-X7600

Choose the DEZ-X7600 when you need to inspect hidden solder joints, internal electronic structures or suspected PCBA defects.

It is suitable for BGA and CSP solder-ball inspection, QFN and LGA thermal-pad analysis, first-article verification, failure analysis and inspection after component replacement. Multi-angle observation helps separate structures that overlap in a vertical X-ray image.

The DEZ-X7600 is an offline inspection system. It is intended for sample inspection, first-article analysis, production troubleshooting and targeted quality control rather than automatic inspection of every PCBA in an inline production line.

2. X-Ray Component Counter for SMT Reels – DEZ-XC1000

Choose the DEZ-XC1000 when the problem is inaccurate remaining-reel quantities rather than PCBA solder defects.

The machine counts components inside compatible reels, trays or tubes without unwinding the carrier tape. It can be used for incoming material verification, production kitting, remaining-material returns and inventory control.

MES, ERP or WMS connectivity can be configured according to the customer’s material-management system. Actual reels or packaging should be tested when components are stacked, overlapping or irregularly arranged.

3. Microfocus PCB X-Ray Sources

A microfocus X-ray source is intended for manufacturers and system integrators building or upgrading an inspection platform. It is not a complete X-ray inspection machine.

The 90 kV Microfocus X-Ray Source – L9421-02 suits applications that prioritise a smaller focal spot and high-magnification electronic inspection.

The 130 kV Microfocus X-Ray Source – L9181-05 provides stronger penetration for thicker PCBAs, dense electronic assemblies and compatible industrial samples.

X-Ray Inspection Before and After BGA Rework

Removing a BGA without confirming the defect can waste a usable component and expose the PCB to unnecessary heating.

The recommended process is to locate the suspected defect with X-ray inspection, replace the component using a suitable BGA rework station, and then inspect the replacement joints before electrical and functional verification.

Where PCB X-Ray Inspection Is Used

In automotive electronics manufacturing, X-ray inspection can examine hidden connections in control modules, sensors, power electronics and infotainment assemblies.

Telecommunications equipment manufacturers use X-ray inspection for multilayer PCBAs containing processors, FPGAs and high-density BGA packages.

For EMS and contract electronics manufacturing, an offline X-ray system supports first-article inspection and failure analysis across different customer products, while an X-ray component counter supports material control.