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The DEZ-H3800S automatically transfers PCB carriers through selective fluxing, dual-side infrared preheating and nitrogen-assisted mini-wave soldering.
The carrier enters through the inline conveyor and remains clamped during processing. Servo-controlled motion positions the flux valve and soldering nozzle at each programmed through-hole joint with ±0.05 mm accuracy.
The H3800S is designed for manufacturers moving from offline manual loading to continuous inline production. It processes one carrier through the complete sequence before transferring the finished PCBA downstream, making it suitable for medium-volume THT assembly and mixed-technology PCBAs up to 400 × 400 mm.
The H3800S is intended for manufacturers that need automatic inline selective soldering but do not require the footprint or parallel processing capacity of a larger multi-station system.
It is particularly useful when a PCBA contains temperature-sensitive SMT components alongside through-hole connectors, transformers, relays, terminals or power components. Instead of passing the complete assembly over a conventional solder wave, the H3800S applies flux and solder only to the programmed joints.
This reduces unnecessary thermal exposure, limits flux contamination outside the soldering area and improves repeatability compared with manual soldering.


| Parameter | DEZ-H3800S |
|---|---|
| Machine dimensions | 1550 mm (L) × 1860 mm (W) × 1680 mm (H) |
| Installed power | 12 kW |
| Operating power consumption | 4–6 kW |
| Power supply | Single-phase 220 V, 50 Hz |
| Net weight | Approx. 920 kg |
| Air pressure | 3–5 bar |
| Air consumption | 8–12 L/min |
| Nitrogen pressure | 3–4 bar |
| Required nitrogen supply | More than 2 m³/h |
| Recommended nitrogen purity | ≥99.998% |
| Exhaust requirement | 500–800 m³/h |
| Carrier requirement | Required |
| Maximum carrier size | 400 mm (L) × 400 mm (W) |
| Conveyor width | 100–400 mm |
| Supported board/carrier thickness | 1–4 mm |
| Conveyor direction | Left to right |
| Top clearance | 120 mm |
| Bottom clearance | 30 mm |
| Maximum conveyor load | Less than 12 kg |
| Conveyor height | 900 ±30 mm |
| Fluxing motion | X–Y servo control |
| Soldering motion | X–Y–Z servo control |
| Positioning accuracy | ±0.05 mm |
| Flux nozzle | Jet valve |
| Flux tank capacity | 1 L |
| Preheating method | Upper and lower infrared heating |
| Preheater power | 6 kW |
| Preheating temperature setting | 25–240°C |
| Solder pot quantity | 1 |
| Solder pot capacity | 13 kg |
| Maximum solder temperature | 350°C |
| Solder heater | 1.2 kW |
| Standard solder nozzles | 3, 4, 5, 6 and 8 mm inner diameters |
| Nitrogen heating | Standard |
| Nitrogen temperature control | PID, 0–350°C |
| Nitrogen consumption at solder pot | 1–2 m³/h |
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Yes. The specified inline configuration requires a carrier to support transport, clamping and repeatable positioning. The maximum carrier size is 400 × 400 mm.
Choose the H3800S when automatic inline loading and unloading are required. Choose the Selective Soldering H3600A when manual loading is acceptable and lower-volume or flexible offline production is the priority.
Choose the Inline Selective Soldering Machine H3900A when larger carriers, separate processing stations or higher continuous production capacity are required. The H3800S is the more compact inline option for sequential processing.
The solder pot can operate up to 350°C, but alloy compatibility and the required working temperature should be confirmed before ordering. Sample testing is recommended.
Yes. Standard nozzle inner diameters are 3, 4, 5, 6 and 8 mm. Custom nozzle geometry can be evaluated according to joint size, component spacing and bottom-side accessibility.
Yes. Conveyor height, transfer direction, carrier dimensions, communication interface and upstream/downstream equipment must be confirmed during line planning.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
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