Inline Selective Soldering Machine for Automated PCBA Production | DEZ-H3800S

The DEZ-H3800S automatically transfers PCB carriers through selective fluxing, dual-side infrared preheating and nitrogen-assisted mini-wave soldering.

The carrier enters through the inline conveyor and remains clamped during processing. Servo-controlled motion positions the flux valve and soldering nozzle at each programmed through-hole joint with ±0.05 mm accuracy.

The H3800S is designed for manufacturers moving from offline manual loading to continuous inline production. It processes one carrier through the complete sequence before transferring the finished PCBA downstream, making it suitable for medium-volume THT assembly and mixed-technology PCBAs up to 400 × 400 mm.

Key Features

  • Automatic inline carrier loading and unloading
  • Selective fluxing, dual-side IR preheating and mini-wave soldering
  • Supports carriers up to 400 × 400 mm
  • Conveyor width adjustable from 100 to 400 mm
  • XYZ servo-controlled soldering platform
  • ±0.05 mm positioning accuracy
  • 6 kW upper and lower infrared preheating
  • 13 kg titanium-alloy solder pot
  • Maximum solder temperature of 350°C
  • Nitrogen-heated soldering nozzle
  • Five standard nozzles from 3 to 8 mm
  • Industrial PC and controller with stored product recipes
  • Live camera monitoring during soldering
  • Maximum carrier load below 12 kg
  • SMEMA-compatible inline transport
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Where the DEZ-H3800S Fits

The H3800S is intended for manufacturers that need automatic inline selective soldering but do not require the footprint or parallel processing capacity of a larger multi-station system.

It is particularly useful when a PCBA contains temperature-sensitive SMT components alongside through-hole connectors, transformers, relays, terminals or power components. Instead of passing the complete assembly over a conventional solder wave, the H3800S applies flux and solder only to the programmed joints.

This reduces unnecessary thermal exposure, limits flux contamination outside the soldering area and improves repeatability compared with manual soldering.

Automatic Inline Selective Soldering Machine Diagram Showing front and Rear Sizes

What Problems Does It Solve?

Inconsistent Manual Through-Hole Soldering

Manual soldering can produce different dwell times, solder volumes and joint shapes between operators and production shifts. The H3800S stores soldering paths, temperatures, speeds and Z-axis settings as process recipes, allowing the same parameters to be repeated for each carrier.

Unnecessary Heat from Conventional Wave Soldering

Mixed-technology PCBAs may contain only a few through-hole components. Processing the entire assembly through a full solder wave can expose nearby components and board areas to unnecessary heat. Selective nozzles target only the required joints.

Production Interruptions Caused by Offline Equipment

Manual loading and unloading create additional handling between assembly stages. The inline conveyor allows the H3800S to receive and discharge carriers automatically as part of the production line.

Poor Wetting and Excessive Solder Oxidation

Insufficient preheating can cause poor flux activation, while exposed molten solder can oxidise and generate dross. Upper and lower infrared preheating prepares the assembly before soldering, while heated nitrogen surrounds the soldering area to support wetting and reduce oxidation.
Automatic Inline Selective Soldering Machine Working Process

Inline Selective Soldering Process

PCB Carrier Loading → Selective Flux Application → Upper and Lower IR Preheating → Programmable Selective Soldering → Automatic Unloading
The carrier enters through the inline conveyor and is clamped in position. The jet valve applies flux only to the programmed soldering points. Upper and lower infrared heaters raise the board temperature before soldering. The servo-controlled soldering system then follows the programmed path, controlling nozzle position, travel speed, wave height and solder contact time. After processing, the carrier is released to the downstream station.
The H3800S processes the carrier through these stages sequentially. For simultaneous processing across separate fluxing, preheating and soldering stations, the DEZ-H3900A is the more suitable model.

DEZ-H3800S Selective Soldering Technical Specifications

ParameterDEZ-H3800S
Machine dimensions1550 mm (L) × 1860 mm (W) × 1680 mm (H)
Installed power12 kW
Operating power consumption4–6 kW
Power supplySingle-phase 220 V, 50 Hz
Net weightApprox. 920 kg
Air pressure3–5 bar
Air consumption8–12 L/min
Nitrogen pressure3–4 bar
Required nitrogen supplyMore than 2 m³/h
Recommended nitrogen purity≥99.998%
Exhaust requirement500–800 m³/h
Carrier requirementRequired
Maximum carrier size400 mm (L) × 400 mm (W)
Conveyor width100–400 mm
Supported board/carrier thickness1–4 mm
Conveyor directionLeft to right
Top clearance120 mm
Bottom clearance30 mm
Maximum conveyor loadLess than 12 kg
Conveyor height900 ±30 mm
Fluxing motionX–Y servo control
Soldering motionX–Y–Z servo control
Positioning accuracy±0.05 mm
Flux nozzleJet valve
Flux tank capacity1 L
Preheating methodUpper and lower infrared heating
Preheater power6 kW
Preheating temperature setting25–240°C
Solder pot quantity1
Solder pot capacity13 kg
Maximum solder temperature350°C
Solder heater1.2 kW
Standard solder nozzles3, 4, 5, 6 and 8 mm inner diameters
Nitrogen heatingStandard
Nitrogen temperature controlPID, 0–350°C
Nitrogen consumption at solder pot1–2 m³/h

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DEZ-SMT-Partner-BAE-SYSTEMS DEZ-SMT-Partner-Dextra DEZ-SMT-Partner-eolane DEZ-SMT-Partner-Foxconn DEZ-SMT-Partner-IMI DEZ-SMT-Partner-JABIL DEZ-SMT-Partner-LACROIX DEZ-SMT-Partner-Laudren-Electronique DEZ-SMT-Partner-LEAB DEZ-SMT-Partner-MULTILASEr DEZ-SMT-Partner-RENISHAW DEZ-SMT-Partner-SANMINA DEZ-SMT-Partner-UNIVERSAL DEZ-SMT-Partner-Visteon

H3800S Inline Selective Soldering Process Systems

Automatic Inline Selective Soldering Machine Fluxing System
Selective Flux Application
A programmable jet valve applies flux to defined through-hole areas instead of coating the entire underside of the PCB. The 1 L pressure tank maintains a stable supply during processing. Flux type and solids content should be confirmed during sample testing.
Inline Selective Soldering Machine Bottom IR Heaters
Upper and Lower Infrared Preheating
The 6 kW preheating system heats both sides of the assembly within a specified range of 25–240°C. The actual board temperature and preheating profile must be established according to PCB thickness, copper content, component thermal mass and flux requirements.
Inline Selective Soldering Machine Motion Platforms
Servo-Controlled Soldering
The XYZ soldering platform uses Panasonic servo motors and Hiwin motion components. Positioning accuracy is specified at ±0.05 mm. Soldering paths, travel speeds, Z-axis height and related process settings are programmed through the industrial control computer.
PCB Selective Soldering Machine DEZ-H3200A Flux Storage Box
Nitrogen-Assisted Solder Pot
The solder pot supports a maximum operating temperature of 350°C and includes PID-controlled nitrogen heating. Nitrogen helps limit oxidation around the nozzle and supports stable solder wetting. Standard nozzle inner diameters are 3, 4, 5, 6 and 8 mm; other shapes can be produced according to the PCB layout.
Automatic Inline Selective Soldering Machine Wheel for Conveyor
Inline Carrier Transport
The roller conveyor supports left-to-right production flow, adjustable conveyor widths from 100 to 400 mm and carrier loads below 12 kg. A carrier is required to provide stable transport and positioning during fluxing, preheating and soldering.
PCB Selective Soldering

Suitable PCB Assemblies

The H3800S is suitable for mixed-technology PCBAs containing through-hole connectors, pin headers, relays, transformers, terminals, coils and power components that cannot be completed through SMT reflow alone.
Typical applications include automotive control modules, industrial controllers, power electronics, telecommunications equipment, medical electronics and EMS production. Suitability should be determined by joint accessibility, component spacing, bottom-side clearance, thermal mass and the required solder alloy.

FAQs by Inline Selective Soldering

Does the H3800S require a PCB carrier?

Yes. The specified inline configuration requires a carrier to support transport, clamping and repeatable positioning. The maximum carrier size is 400 × 400 mm.

Choose the H3800S when automatic inline loading and unloading are required. Choose the Selective Soldering H3600A when manual loading is acceptable and lower-volume or flexible offline production is the priority.

Choose the Inline Selective Soldering Machine H3900A when larger carriers, separate processing stations or higher continuous production capacity are required. The H3800S is the more compact inline option for sequential processing.

The solder pot can operate up to 350°C, but alloy compatibility and the required working temperature should be confirmed before ordering. Sample testing is recommended.

Yes. Standard nozzle inner diameters are 3, 4, 5, 6 and 8 mm. Custom nozzle geometry can be evaluated according to joint size, component spacing and bottom-side accessibility.

Yes. Conveyor height, transfer direction, carrier dimensions, communication interface and upstream/downstream equipment must be confirmed during line planning.

Send Your SMT Equipment Requirements

Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.

Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.

An equipment specialist will contact you within one hour during business hours.

Get a Free Recommendation and Request Sample Testing
Email: [email protected]
Phone: +86 138 2338 9052

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