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The DEZ-C780 Pneumatic Stencil Cleaning Machine removes solder paste, red glue, flux and other printing residues from SMT stencils and screen meshes.
Two stencils measuring up to 750mm × 750mm × 40 mm can be cleaned in one cycle. Double-sided rotating spray nozzles deliver cleaning solvent to both stencil surfaces and through fine apertures, followed by compressed-air drying inside the same chamber.
The machine operates entirely with compressed air. It does not require electrical power or a water supply for the cleaning process, making it suitable for factories that use solvent-based stencil cleaning and want to avoid a separate rinsing stage.
Key operating data:
Solder paste and adhesive left inside stencil apertures can dry or accumulate between production runs. If these deposits are not removed completely, the next printing process may produce:
The DEZ-C780 uses a 360° rotating, double-sided equal-pressure spray system to reach both stencil surfaces and force cleaning liquid through the apertures. It is intended for complete offline cleaning after production runs, product changeovers or extended stencil storage—not simply surface wiping during printing.

| Specification | DEZ-C780 |
|---|---|
| Applicable Stencil Size | 750 × 750 × 40 mm, up to 2 pieces; custom sizes available |
| Cleaning Method | 360° rotating, double-sided equal-pressure high-pressure spray with blow drying |
| Cleaning Time | 2–4 minutes |
| Drying Time | 2–5 minutes |
| External Air Source | 0.4–0.6 MPa |
| Air Consumption | 400–600 L/min |
| Filtration System | Three stages: 10 μm, 5 μm and 1 μm |
| Maximum Liquid Tank Capacity | 40 L × 2 |
| Machine Dimensions | 1000 × 1400 × 1730 mm |
| Machine Net Weight | 600 kg |
We have worked with
Yes. It supports up to two stencils measuring 750 × 750 × 40 mm. Custom sizes can be evaluated separately.
The DEZ-C780 is pneumatically operated and uses an external compressed-air supply. No electrical power is required for the normal cleaning process.
No. It uses compatible cleaning solvent followed by compressed-air drying, so no water-rinsing stage is required.
Yes, provided that the selected cleaning solvent is compatible with the adhesive residue and stencil material. Sample testing is recommended for cured or difficult adhesive deposits.
Cleaning takes approximately 2–4 minutes, while drying takes approximately 2–5 minutes. Actual time depends on the residue, stencil condition and selected process settings.
Yes. The liquid passes through 10 μm, 5 μm and 1 μm filters before recirculation. The solvent must still be replaced when contamination reaches the applicable process limit.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
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