Flux marks and loose solder balls left on the solder side of a PCBA can interfere with inspection, coating, assembly and final product cleanliness. Manual brushing is difficult to standardise and increases operator contact with cleaning chemicals.
The DEZ-C758 automates this surface-cleaning operation. PCBAs pass through controlled cleaner application, multidirectional wet brushing, dry brushing and fan drying. The process targets the accessible solder side while limiting cleaner exposure on the component side.
It is designed for continuous cleaning of PCBAs from 50 to 300 mm wide, with component heights up to 135 mm.
The C758 removes accessible surface contamination from the solder side of assembled boards. Its main targets are visible flux residue, flux marks, dust, process debris and loose solder balls that can be reached by the cleaning brushes.
The machine is particularly useful after wave soldering, selective soldering or other processes that leave contamination concentrated on one side of the assembly.
Because the cleaning mechanism uses physical brush contact, the PCB layout must provide sufficient access around solder joints, protruding leads and bottom-side components.
| Parameter | DEZ-C758 |
|---|---|
| Machine dimensions | 1860 mm (L) × 820 mm (W) × 1200 mm (H), ±20 mm |
| Machine weight | Approx. 400 kg |
| Supported PCBA width | 50–300 mm |
| Maximum component height | 135 mm |
| Conveyor direction | Left to right or right to left |
| Incoming conveyor | Standard |
| Outgoing conveyor | Optional |
| Conveyor rail configuration | Fixed front rail with movable rear rail, or bilateral movable rails |
| Claw configuration | Thickened double claws or heavy-duty claws |
| Conveyor speed | 0.05–1.8 m/min, continuously adjustable |
| Conveyor connection height | 750 ±20 mm |
| Cleaner application roller | Ø100 mm |
| Round brush | Ø300 mm |
| Brush-height adjustment | 0–20 mm |
| Brush spindle speed | 0–500 rpm |
| Cleaning-agent flow | 50–1500 ml/min |
| Liquid tank capacity | Maximum 20 L |
| Drying method | Fan air drying |
| Control system | PLC with push-button controls |
| Installed power | 1 kW |
| Operating power | Approx. 0.4 kW |
| Operating voltage | 220 V, 50 Hz |
| Exhaust requirement | 10 m³/min, subject to interface confirmation |
We have worked with
No. It is designed to clean the accessible solder side while limiting cleaner contact with the component side.
Only when the residue is physically accessible to the cleaner and brushes. It is not designed to flush contamination from underneath low-standoff components. Use an aqueous spray-cleaning system for deeper cleaning requirements.
It can remove loose solder balls that are accessible to the brushes. Solder balls attached beneath components or trapped in narrow gaps may require another cleaning method.
No DI-water rinse stage is specified for the C758. It uses controlled cleaner application, wet brushing, dry brushing and fan drying.
Possibly, but “no-clean” flux residues can be difficult to remove. Cleaner compatibility and process settings must be verified using the actual flux and PCBA.
The process must be tested whenever components, leads or other structures are present on the cleaning side. Brush height, speed and contact pressure should be established through sample testing.
The current specification table states a supported width of 50–300 mm. Board length, thickness and minimum supported edge must still be confirmed with the factory.
It uses automatic conveyor transport, but the specified connection height is 750 ±20 mm rather than the common 900 mm SMT line height. Line height, conveyor direction and transfer interface must therefore be confirmed before ordering.
Choose the C743 when the PCBA requires batch chemical cleaning, rinsing and hot-air drying, or when contamination is not limited to an accessible single surface.
Yes. Provide sample boards, contamination photographs, flux information and acceptance requirements. The test should confirm cleaning results, component safety, cleaner compatibility and processing speed.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
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