The DEZ-H3900A integrates selective fluxing, dual-side preheating and nitrogen-assisted mini-wave soldering into one automatic inline system.
Three PCB carriers can be processed at different stations simultaneously: one receives flux, one is preheated and one is selectively soldered. This parallel workflow prevents the fluxing and preheating stages from waiting for the soldering cycle to finish.
The machine accepts carriers up to 500 × 600 mm and provides a maximum soldering area of 500 × 450 mm. It is designed for large PCBAs, continuous THT production and manufacturers replacing manual transfer between separate fluxing, preheating and soldering equipment.
In a single-station selective soldering machine, one PCB completes fluxing, preheating and soldering before the next board starts. The soldering path is usually the longest part of the cycle, leaving the other process functions waiting.
The H3900A separates fluxing, preheating and soldering into three stations. When the first carrier moves to soldering, the second carrier can enter preheating while the third receives flux.
This overlapping process increases production capacity without requiring three separate machines. Automatic carrier transfer also removes repeated manual loading between process stages and keeps the PCBA orientation consistent throughout production.
| Process | Function |
|---|---|
| Inline loading | The upstream conveyor transfers the PCB carrier into the machine |
| Carrier positioning | The conveyor clamps and positions the carrier at the fluxing station |
| Selective fluxing | The XY servo platform applies flux to the programmed THT areas |
| Dual-side preheating | Upper and lower heating prepares the PCB, flux and component leads |
| Selective soldering | The XYZ servo platform moves the programmed joints across the nitrogen-assisted mini-wave |
| Parallel processing | Fluxing, preheating and soldering operate on three different carriers simultaneously |
| Inline unloading | The completed carrier transfers automatically to inspection or the next process |
| Specification | DEZ-H3900A |
|---|---|
| Machine Dimensions | L3150 × W1680 × H1690 mm |
| Total Power | 20 kW |
| Operating Power | 6–10 kW |
| Power Supply | AC 380 V |
| Net Weight | 1500 kg |
| Maximum Carrier Size | L500 × W600 mm |
| Maximum Soldering Area | L500 × W450 mm |
| Carrier Requirement | Required |
| Conveyor Width | 300–600 mm |
| Carrier Thickness | 1–4 mm |
| Conveyor Direction | Left to right |
| Conveyor Height | 900 ±30 mm |
| Top Component Clearance | 100 mm; customisable |
| Bottom Component Clearance | 30 mm |
| Maximum Conveyor Load | <10 kg |
| Conveyor Type | Pin chain for fluxing/preheating; roller conveyor for soldering |
| Control System | PLC and motion controller |
| Fluxing Motion | XY servo control |
| Soldering Motion | XYZ servo control |
| Positioning Accuracy | ±0.05 mm |
| Flux Tank Capacity | 1 L |
| Preheating Method | Upper and lower heating |
| Preheating Power | 6 kW |
| Preheating Temperature | 25–240°C |
| Solder Pot Quantity | One |
| Solder Pot Capacity | 13 kg |
| Solder Melting Time | Approximately 75 minutes to 260°C |
| Maximum Solder Temperature | 350°C |
| Solder Pot Power | 1.2 kW |
| Standard Nozzles | 3, 4, 5, 6 and 8 mm |
| Air Pressure | 3–5 bar |
| Air Consumption | 8–12 L/min |
| Nitrogen Pressure | 3–4 bar |
| Nitrogen Purity | >99.998% |
| Nitrogen Supply | >1.5 m³/h |
| Nitrogen Consumption | 1–2 m³/h per nozzle |
| Fluxing Exhaust | 800–1000 m³/h |
| Soldering Exhaust | 600–800 m³/h |
We have worked with
| Production Requirement | H3200A/H3500A/H3600A | DEZ-H3900A |
|---|---|---|
| Loading and Unloading | Manual | Automatic inline transfer |
| Process Arrangement | One board completes the stages sequentially | Three carriers occupy separate stages |
| Maximum Carrier Size | Model dependent | 500 × 600 mm |
| Maximum Soldering Area | Up to 400 × 300 mm | 500 × 450 mm |
| Integrated Preheating | H3600A only | Upper and lower preheating |
| Line Integration | Standalone | Inline production |
| Best Fit | Prototype, high-mix and lower-volume batches | Continuous production and larger PCBAs |
One PCBA is soldered while two other carriers complete fluxing and preheating. The machine processes three carriers in parallel stages, but only one carrier occupies the soldering station.
Yes. The current specification requires a carrier for inline transport and positioning. The carrier must match the conveyor width, thickness, load and component-clearance requirements.
The machine accepts carriers up to 500 × 600 mm, but the maximum programmable soldering area is 500 × 450 mm. All required THT joints must remain inside the soldering range.
It supports automatic inline transfer, but conveyor height, direction, width, communication interface and upstream/downstream timing must be confirmed before installation.
The machine requires AC 380 V power, compressed air at 3–5 bar and nitrogen above 99.998% purity at 3–4 bar.
The fluxing area requires approximately 800–1000 m³/h exhaust capacity, while the soldering area requires approximately 600–800 m³/h. The factory must confirm that these utilities are available at the installation position.
Choose the H3900A when production requires carriers up to 500 × 600 mm, a soldering area up to 500 × 450 mm and parallel fluxing, preheating and soldering. The Batch selective soldering machine H3800S is more suitable when the PCB size and production capacity do not require the larger three-station H3900A configuration.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
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