The DEZ-D59-2N SMT Nitrogen Generator produces high-purity nitrogen on site for selective soldering, compact reflow ovens and other compatible electronics-manufacturing processes.
Using pressure swing adsorption technology, the generator separates nitrogen from clean, dry compressed air. It provides a standard output of 3 Nm³/h, purity up to 99.999% and adjustable pressure from 0.1 to 0.65 MPa.
On-site nitrogen generation reduces dependence on delivered cylinders and gives the factory greater control over gas purity, pressure and availability.
Send DEZ your soldering-machine model and specified nitrogen consumption. We will confirm whether the standard 3 Nm³/h generator is sufficient or a higher-flow configuration is required.
| Capability | Customer Benefit |
|---|---|
| 3 Nm³/h nitrogen output | Supplies compatible SMT soldering processes |
| Purity up to 99.999% | Provides high-purity gas for controlled soldering |
| Adjustable output pressure | Matches different equipment inlet requirements |
| PSA nitrogen generation | Produces nitrogen continuously from compressed air |
| Dual adsorption towers | Maintains production through alternating cycles |
| Real-time purity display | Allows operators to verify nitrogen condition |
| Compact enclosed cabinet | Fits near production equipment or in a utility area |
| 200 W equipment power | Keeps the generator’s electrical demand low |
| Custom flow configuration | Allows larger soldering systems to be evaluated |
Factories using nitrogen cylinders must repeatedly order, store, move and replace them.
An empty cylinder or delayed delivery can interrupt the soldering process even when the production equipment itself is ready to run.
The DEZ-D59-2N generates nitrogen from the factory’s compressed-air supply. This reduces routine cylinder handling and provides nitrogen whenever the air system and generator are operating.
The DEZ-D59-2N uses two adsorption towers filled with carbon molecular sieve.
Clean compressed air enters the system. The molecular sieve adsorbs oxygen, carbon dioxide and residual moisture while allowing nitrogen to pass through.
When the first tower reaches the end of its adsorption cycle, the second tower continues production while the first regenerates.
Process Flow: Compressed Air → Filtration and Drying → PSA Adsorption → Nitrogen Separation → Purity Monitoring → Soldering Equipment
Alternating tower operation provides continuous nitrogen generation without consuming chemical raw materials.
| Parameter | Specification |
|---|---|
| Nitrogen Flow | 3 Nm³/h |
| Nitrogen Purity | Up to 99.999% |
| Output Pressure | 0.1–0.65 MPa adjustable |
| Nitrogen Dew Point | ≤−40°C |
| Required Air Pressure | 0.6–0.8 MPa |
| Required Air Dew Point | ≤−10°C |
| Power Supply | AC 220 V, 50/60 Hz |
| Equipment Power | 200 W |
| Machine Dimensions | 950 × 410 × 1,260 mm |
| Comparison | PSA Nitrogen Generator | Nitrogen Cylinders |
|---|---|---|
| Supply source | Generated from compressed air | Delivered by gas supplier |
| Production duration | Continuous with utilities available | Limited by cylinder capacity |
| Replacement | No routine cylinder changes | Regular replacement required |
| Purity monitoring | Real-time display | Depends on external documentation |
| Storage | Fixed equipment installation | Cylinder storage required |
| Main cost | Air, power and maintenance | Gas purchase, delivery and rental |
| Suitable use | Regular nitrogen consumption | Occasional use or emergency backup |
We have worked with
No. It can supply compatible reflow soldering and other electronics processes, but the 3 Nm³/h flow is particularly suited to lower-consumption applications.
Only if the oven’s specified consumption is within 3 Nm³/h. Many industrial multi-zone ovens require a higher-flow generator.
The standard output is 3 Nm³/h.
The listed maximum nitrogen purity is 99.999%.
The output pressure can be adjusted from 0.1 to 0.65 MPa.
Only when their combined continuous and peak consumption remains within the generator capacity. A larger central system may be required.
Not necessarily. Purity should be selected according to the soldering equipment and target oxygen concentration. Flow and pressure must also remain sufficient.
Nitrogen flow, pressure, voltage and system configuration can be evaluated according to the customer’s application.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
An equipment specialist will contact you within one hour during business hours.
Get a Free Recommendation and Request Sample Testing
Email: [email protected]
Phone: +86 138 2338 9052
