SMT Stencil Cleaning Solutions

Solder paste, red glue and flux can remain inside stencil apertures and on the underside of the stencil after printing. Dried residue can restrict paste release, contaminate the next PCB and produce inconsistent deposits.
DEZ provides pneumatic solvent and automatic water-based stencil cleaning machines. Enclosed spray cleaning reaches both stencil surfaces and fine apertures, followed by compressed-air or heated-air drying.
Request Sample Cleaning

Problems Solved by Stencil Cleaning

Blocked Stencil Apertures

Removes solder paste and compatible residue from fine apertures before the stencil returns to printing.

Solder Paste on the Stencil Underside

Cleans residue that can transfer to the next PCB and create smeared or unwanted solder paste deposits.

Dried Solder Paste and Red Glue

Spray cleaning reaches residue that is difficult to remove consistently by manual wiping.

Inconsistent Manual Cleaning

A controlled cleaning cycle processes both stencil surfaces without depending on operator wiping pressure and cleaning time.

Damage from Manual Tools

Spray cleaning avoids scraping fine apertures with brushes, blades or other tools that may damage the stencil.

Contamination During Product Changeovers

Stencils can be cleaned before storage or before changing to another solder paste, adhesive or PCB model.

Residue Left After Cleaning

Filtration separates removed paste and particles from recirculated cleaning liquid. Suitable drying prevents liquid from remaining inside stencil apertures.

Recommended Stencil Cleaning Equipment

Choose the right stencil cleaning equipment for solvent-based, pneumatic, or water-based SMT cleaning requirements.

Solder Paste Stencil Cleaning FAQ

Which Machine Fits Our Stencil Size?

The DEZ-C730 and DEZ-C780 support stencils up to 750 × 750 × 40 mm. The DEZ-C750 supports stencils up to 740 × 740 × 40 mm.

The choice depends on the solder paste, red glue, required cleaning result, approved chemistry and available factory utilities. The water-based process includes rinsing, while the pneumatic machines use compatible solvent without a water-rinse stage.

The DEZ-C780 holds two compatible stencils in one cleaning cycle.

Yes, when the cleaning chemistry is compatible with the residue. Sample cleaning is recommended for dried paste and fine apertures.

Yes. All three machines can remove compatible red glue, solder paste and flux residue.

The DEZ-C730 and DEZ-C780 require compressed air. The DEZ-C780 does not require electrical power or water. The DEZ-C750 requires power, compressed air and water for its wash, rinse and dry process.

The DEZ-C730 can clean compatible steel, copper and silk mesh screens. The DEZ-C750 can process compatible squeegees, printing tools and fixtures.

PCB Assembly Applications & SMT Process Solutions DEZ SMT

Explore More Electronics Manufacturing Applications

DEZ equipment also supports stencil cleaning, PCB surface cleaning before printing, post-solder PCBA cleaning, fixture cleaning, selective soldering, X-ray inspection and SMT line handling.

Explore all applications to find equipment according to the production process and current manufacturing problem.

Request a Quote Explore All Applications

Request a Stencil Cleaning Solution

Send us the stencil dimensions, frame thickness, aperture size, solder paste or adhesive type, daily cleaning quantity and preferred cleaning chemistry.

A contaminated stencil can be tested before machine selection. DEZ will recommend pneumatic solvent cleaning or automatic water-based washing and rinsing according to the required process.

Drag & Drop Files, Choose Files to Upload, or Capture With Your Camera

Related SMT Process Articles

We share our SMT manufacturing expertise to help you optimize soldering, PCBA cleaning, inspection, and production efficiency.