The DEZ-R880A Automatic BGA Rework Station is designed for controlled removal and replacement of BGA, QFN, CSP, POP, QFP, LED and Micro-SMD components.
It combines seven-axis electric motion, 1080P optical alignment, servo-controlled component placement and three independently controlled heating zones.
Compared with a conventional semi-automatic rework station, the DEZ-R880A reduces manual movement during alignment, heating and placement. This improves process repeatability when repairing large PCB assemblies, large BGA packages or multiple product batches.
The machine supports PCBs up to 710 × 490 mm and components from 0.5 × 0.5 mm to 120 × 120 mm.
| Parameter | Specification |
|---|---|
| PCB Size | 6 × 6–710 × 490 mm |
| Component Size | 0.5 × 0.5–120 × 120 mm |
| Placement Accuracy | ±0.01 mm |
| Heating System | Upper hot air + lower hot air + infrared preheating |
| Total Heating Power | 8,400 W |
| Temperature Accuracy | Up to ±1°C |
| Optical Alignment | 1080P CCD |
| Motion Control | Seven-axis electric control with 360° component rotation |
| Power Supply | AC 220 V or 380 V, 50/60 Hz |
| Machine Dimensions | 1,160 × 1,080 × 1,100 mm |
BGA rework becomes inconsistent when every movement depends on the operator manually adjusting the PCB, optical system, heater and component.
Small differences in position, angle, placement pressure or heating time can produce different results between two otherwise identical repairs.
The DEZ-R880A replaces many of these manual adjustments with electrically controlled movement. This is particularly useful when a factory repairs:
Large PCBs, thick copper layers and heavy ground planes absorb heat unevenly.
When the repair area heats much faster than the surrounding board, the PCB may bend or twist. This can affect the target component and nearby solder joints.
The R880A’s high-power infrared preheater distributes heat across a larger area before the local solder reaches reflow temperature. Controlled preheating helps:
The temperature profile can be adjusted according to PCB thickness, copper distribution, package size and solder alloy.
| Parameter | Specification |
|---|---|
| Model | DEZ-R880A |
| Equipment type | Automatic high-precision optical BGA rework station |
| PCB size | 6 × 6–710 × 490 mm |
| Component size | 0.5 × 0.5–120 × 120 mm |
| Applicable packages | BGA, CSP, POP, QFN, QFP, LED and Micro-SMD |
| Mounting accuracy | Listed ±0.01 mm |
| Component rotation | 360° electric rotation |
| Motion control | Dual joystick and seven-axis electric motion |
| Positioning | V-groove fixture and laser red-dot positioning |
| Optical system | 1080P high-definition CCD alignment |
| Heating system | Upper hot air, lower hot air and infrared preheating |
| Upper heater | 1,600 W |
| Lower heater | 1,600 W |
| Infrared heater | 5,000 W |
| Total power | Maximum 8,400 W |
| Temperature control | Omega K-type thermocouple closed-loop control |
| Listed temperature accuracy | Up to ±1°C |
| Component handling | Automatic feeding and receiving |
| Pressure control | Built-in pressure detection |
| Sensor quantity | 5 |
| Vacuum supply | Built-in vacuum pump |
| Power supply | AC two-phase 220 V or 380 V, 50/60 Hz |
| Machine dimensions | 1,160 × 1,080 × 1,100 mm |
| Machine weight | Approximately 160 kg |
| Selection Factor | DEZ-R880A | DEZ-R820 |
|---|---|---|
| Main positioning | Automatic high-precision rework | Semi-automatic optical rework |
| Maximum PCB size | 710 × 490 mm | 415 × 370 mm |
| Component range | 0.5 × 0.5–120 × 120 mm | 2 × 2–80 × 80 mm |
| Total heating power | 8,400 W | 5,300 W |
| IR preheater | 5,000 W | 2,700 W |
| Listed temperature accuracy | Up to ±1°C | ±3°C |
| Placement system | Servo-controlled | Controlled Z-axis placement |
| Listed mounting accuracy | ±0.01 mm | Not specified on current product page |
| Component rotation | 360° electric | Operator-adjusted configuration |
| Motion control | Seven-axis electric control | Primarily semi-automatic |
| Optical system | 1080P with electric X/Y movement | CCD optical alignment |
| Component handling | Automatic feeding and receiving | Automatic placement and removal |
| Best suited to | Large boards, large packages and repeated rework | Standard boards, mixed repair and lower-volume work |
We have worked with
The BGA rework station repairs the component, but it cannot directly see every solder joint underneath the package after installation.
The recommended quality workflow is:
DEZ-X7600 PCBA X-Ray Inspection → DEZ-R880A Automatic Rework → Post-Rework X-Ray Verification
This creates a controlled inspection, repair and verification loop for high-value PCB assemblies.
It uses electric seven-axis movement, automatic component handling, servo placement, electric rotation and programmed desoldering and soldering processes.
The machine supports PCB assemblies up to 710 × 490 mm.
The listed range is 0.5 × 0.5 mm to 120 × 120 mm.
It supports compatible BGA, CSP, POP, QFN, QFP, LED and Micro-SMD components.
The listed servo placement accuracy is ±0.01 mm.
The 1080P optical system displays the component terminals and PCB pads together before placement.
Yes. The servo-controlled placement head supports 360° electric rotation.
The machine provides a working range up to 710 × 490 mm, movable heating zones and electric positioning across the repair area.
The 5,000 W infrared preheater warms a larger PCB area before local reflow, reducing the thermal difference around the repair position.
The listed configuration includes a built-in vacuum pump.
No. Pad cleaning and preparation remain separate steps between component removal and replacement.
Reballing requires separate stencils, tooling and processing. The R880A performs controlled removal, alignment, placement and soldering.
A separate PCBA X-ray inspection system is recommended for verifying BGA, QFN and other hidden solder joints.
Yes. Customers can provide PCB assemblies, components and defect information for sample rework testing.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.
An equipment specialist will contact you within one hour during business hours.
Get a Free Recommendation and Request Sample Testing
Email: [email protected]
Phone: +86 138 2338 9052
