Industrial Control SMT Manufacturing

Industrial control assemblies often combine processors and surface-mount circuits with relays, terminal blocks, transformers, connectors and high-current components. Thick PCBs, large copper areas and high-thermal-mass components affect heating and solder fill. Assemblies used around machinery, moisture or dust may also require post-solder cleaning and conformal coating.
DEZ provides PCB cleaning, reflow soldering, selective soldering, PCBA cleaning, X-ray inspection, BGA rework and SMT handling equipment for industrial electronics production.

Industrial Control Manufacturing Challenges

Mixed SMT and Through-Hole Components

PLCs, motor drives and controller boards commonly combine fine-pitch SMT devices with connectors, relays, transformers and terminals.

Insufficient Through-Hole Solder Fill

Thick boards, ground planes and high-current connections can draw heat away from the soldering area and reduce barrel fill.

Uneven Heating During Reflow

Power devices, large components and different copper densities can create significant temperature differences across the PCB.

Flux Residue Around Terminals and Relays

Wave or selective soldering can leave residue around through-hole leads, connector pins and high-current solder joints.

Contamination Before Conformal Coating

Residue remaining on the PCBA can be trapped beneath coating intended to protect the assembly from humidity, dust and industrial environments.

Hidden Power-Device Solder Joints

QFN packages, BGA devices and bottom-terminated power components require X-ray inspection when their solder joints cannot be seen.

Large and Heavy PCB Assemblies

Industrial power and control boards may require wider conveyors, suitable board support and handling equipment matched to their weight.

Long Product Life and Repair

Industrial equipment may remain in service for years, creating a continuing need for component replacement and controlled PCBA repair.

Equipment for Industrial Control Production

Support industrial control PCB production with equipment for PCB preparation, reflow and selective soldering, PCBA cleaning, X-ray inspection, BGA rework, and reliable PCB handling.

Industrial Control Electronics FAQ

Which Machine Should We Use for Relays, Terminals and Connectors?

For manually loaded, smaller PCBAs up to 300 × 250 mm, choose the DEZ-H3200A.

For offline production with PCBAs up to 350 × 410 mm, choose the DEZ-H3500A.

For PCBAs up to 400 × 300 mm requiring selective fluxing, infrared preheating and soldering, choose the DEZ-H3600A.

Choose the DEZ-H3800S or DEZ-H3900A when PCB carriers must move automatically through fluxing, dual-side preheating and nitrogen-assisted soldering.

These inline models are more suitable than the H3200A, H3500A or H3600A when the same industrial control board is produced continuously.

For offline production, use the DEZ-H3600A with infrared preheating. For continuous production, use the DEZ-H3800S or DEZ-H3900A with dual-side preheating. Final selection requires the PCB thickness, copper structure and component thermal mass.

Choose the DEZ-C743. It washes, DI-rinses and dries different PCBAs inside one chamber and suits frequent product changes.

Choose the DEZ-C1520 when assemblies must pass continuously through separate washing, DI-water rinsing and drying sections.

Choose the DEZ-C758 when visible flux marks and loose solder balls are limited to one accessible solder-side surface. Use the C743 or C1520 instead when both sides and areas beneath components require washing and DI-water rinsing.

Choose the DEZ-X7600 for BGA, QFN, LGA, CSP and compatible power-device connections. It supports PCB assemblies up to 510 × 450 mm with a platform load of up to 12 kg.

Choose the DEZ-R820 for varied repair work on PCBs up to 415 × 370 mm and components up to 80 × 80 mm. Choose the DEZ-R880A for PCBs up to 710 × 490 mm, components up to 120 × 120 mm and repeated repairs requiring automatic motion and placement.

Request an Industrial Control SMT Solution

Send us the PCB dimensions, thickness, weight, copper structure, component layout, soldering process, flux, coating requirement and production volume.

DEZ will recommend the required cleaning, soldering, inspection, rework and PCB handling equipment for the industrial assembly.

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