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Learn how to choose a selective soldering machine manufacturer by PCBA testing, nozzle access, cycle time, configuration, FAT and support.
Choose a manufacturer that can test your PCBA and prove the process before recommending a machine.
Do not decide from price, PCB size or brochure specifications alone. The Selective Soldering Machine manufacturer must confirm nozzle access, preheating, cycle time, machine configuration and production-line interfaces.
The machine must fit your process—not force your process to fit the machine.
Send the manufacturer your PCB or carrier drawing, marked THT joints, bottom-side component layout, board thickness, solder alloy, flux and required takt time.
The manufacturer should identify inaccessible joints, restricted nozzle paths and high-thermal-mass areas before selecting a model.
Sample soldering should verify:
One acceptable sample is not enough. The same programme should produce repeatable results across several PCBAs.
Nozzle selection depends on pad size, pin spacing and nearby components.
Ask the manufacturer to show which joints use standard nozzles and which require customised nozzles. All required joints must remain within the usable soldering area after carriers and clamps are included.
Preheating should match the board’s thermal demand. Thick multilayer PCBAs, heavy copper planes and large terminals may require controlled preheating.
Cycle time must come from the actual soldering programme. A board with two drag-soldered connectors may run faster than one with many isolated soldering points.

Choose an offline machine when manual loading can meet output and several products share one soldering cell.
Choose an inline machine when carriers must transfer automatically between production stages.
For inline equipment, confirm:
“Inline compatible” is not enough. Every mechanical, electrical and communication interface must appear in the quotation.
Do not compare suppliers by machine price alone.
| Item | What must be confirmed |
|---|---|
| Machine | Offline or inline; process-station arrangement |
| Capacity | Carrier size, usable soldering area and clearances |
| Process | Fluxing, preheating, solder pot and motion system |
| Tooling | Standard and customised nozzles; carrier scope |
| Utilities | Power, air, nitrogen and exhaust |
| Integration | Conveyor and communication interfaces |
| Testing | Sample soldering and FAT acceptance |
| Support | Training, warranty, remote support and spare parts |
Options shown in brochures are not automatically included. Require a written configuration list.
FAT must test the agreed production process. Run the representative PCBA programme several times. Check soldering results, measured cycle time, wave stability, nozzle motion, alarms and safety interlocks. For inline equipment, also test carrier transfer and communication signals.
After delivery, the manufacturer should support installation, programme setup, operator training, process adjustment and spare-parts identification.
Technical support must include soldering-process knowledge, not only electrical troubleshooting.
| Production requirement | DEZ machine |
|---|---|
| Small PCBAs; flexible offline production | DEZ-H3200A — soldering area up to 300 × 250 mm |
| Larger high-mix PCBAs | DEZ-H3500A — soldering area up to 350 × 410 mm |
| Offline production requiring lower infrared preheating | DEZ-H3600A — soldering area up to 400 × 300 mm |
| Inline transfer with sequential processing | DEZ-H3800S — carriers up to 400 × 400 mm |
| Large carriers or parallel process stations | DEZ-H3900A — carriers up to 500 × 600 mm; soldering area up to 500 × 450 mm |
Machine size is only the first limit. DEZ also checks nozzle access, preheating, soldering path and takt time before confirming the model.
DEZ provides application review, sample soldering, machine configuration and inline integration.
Send your PCB or carrier drawing, THT coordinates, bottom-side layout, solder alloy, flux and required output. DEZ will evaluate the process and prepare the correct configuration and quotation.
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