Meet DEZ at NEPCON ASIA 2026, location 13F25, to discuss PCB and PCBA cleaning, selective soldering and SMT stencil cleaning equipment.
Compare red glue stencil cleaning equipment for removing uncured SMT adhesive from apertures using solvent spray or water-based cleaning.
Compare manual, pneumatic solvent, aqueous and ultrasonic stencil cleaning methods by residue, aperture cleaning, drying, capacity and utilities.
How to evaluate an SMT stencil cleaning machine manufacturer using sample testing, chemistry, aperture inspection, capacity, utilities, FAT and support.
How to choose a PCB cleaning machine manufacturer through sample testing, process selection, customisation, FAT and technical support.
Learn how to choose a selective soldering machine manufacturer by PCBA testing, nozzle access, cycle time, configuration, FAT and support.
Compare offline and inline selective soldering by loading method, cycle time, preheating, carrier size and production-line integration.
Identify common wave soldering defects, find their likely causes and correct fluxing, preheating, solder-wave, PCB design and cleaning problems.
When mixed SMT and THT assemblies require selective soldering, when wave or manual soldering remains suitable, and how to select the correct DEZ machine.
Build a controlled high-mix PCBA cleaning process before conformal coating using validated chemistry, DI-water rinsing, drying and cleanliness testing.
