X-ray can reveal solder bridging, voids, missing solder balls, component displacement and abnormal solder distribution. Detectability depends on the package, material density and viewing angle.
No. AOI checks visible component and soldering conditions. X-ray is used when solder joints or internal structures are hidden beneath the component.
The inspection platform supports PCB assemblies up to 510 × 450 mm with a maximum load of 12 kg.
Choose the DEZ-R820 for varied repair work and PCBs up to 415 × 370 mm. Choose the DEZ-R880A for larger boards, larger components and repair processes requiring automatic motion and placement.
The systems support compatible BGA, QFN, CSP, QFP, sockets and other surface-mounted components. The package dimensions and surrounding component clearance must be checked.
Yes, when the board fits the machine and can be supported correctly. Large, thick or high-thermal-mass boards require an appropriate heating profile and bottom support.
Yes. The repaired solder joints can be inspected again to check solder-ball position, bridging, voiding and solder distribution.
Provide the PCB size, weight, component type, package dimensions, defect type, required inspection detail and expected daily inspection or rework quantity.
DEZ equipment also supports stencil cleaning, PCB surface cleaning before printing, post-solder PCBA cleaning, fixture cleaning, selective soldering, X-ray inspection and SMT line handling.
Explore all applications to find equipment according to the production process and current manufacturing problem.
Send us the PCB dimensions, component package, defect description, existing X-ray images and required inspection or repair quantity.
DEZ will recommend an X-ray inspection system, BGA rework station or combined inspection-and-repair process according to the assembly and defect.
We share our SMT manufacturing expertise to help you optimize soldering, PCBA cleaning, inspection, and production efficiency.
