Diagnose white residue, sticky flux films and loose solder balls on PCBAs, then select the correct soldering correction, test and cleaning process.
Compare brush, ionised air, vacuum and tacky rollers for removing particles from bare PCBs and accessible post-solder PCBA surfaces.
How ionic contamination differs from visible PCB residue, what causes electrical risk, how cleanliness is tested and which cleaning process fits.
Learn how PCB surface particles cause solder paste smearing, bridging and insufficient deposits, and how to verify the root cause before reflow.
Learn how PCB cleaning machines remove dust, flux residue and ionic contamination, and compare dry, brush, batch and inline cleaning equipment.
what causes flux residue on PCB assemblies, when cleaning is required, how to select a cleaning process and how to verify cleanliness.
Learn how preheat, soak, reflow and cooling affect solder joints and how to set a profile for the solder paste and PCB thermal mass.
Use this SMT equipment selection checklist to compare PCB size, throughput, process stages, utilities, inspection and maintenance requirements.
See how DEZ checks mechanical assembly, electrical controls, machine functions, customer samples and final configuration before shipment.
Understand which solder defects can be observed beneath bottom-terminated components and when BGA rework may be required.
