Learn how preheat, soak, reflow and cooling affect solder joints and how to set a profile for the solder paste and PCB thermal mass.
Use this SMT equipment selection checklist to compare PCB size, throughput, process stages, utilities, inspection and maintenance requirements.
See how DEZ checks mechanical assembly, electrical controls, machine functions, customer samples and final configuration before shipment.
Understand which solder defects can be observed beneath bottom-terminated components and when BGA rework may be required.
Review how dried solder paste and red glue affect printing and when pneumatic or water-based stencil cleaning should be used.
Compare selective soldering and wave soldering by PCB design, THT joint count, heat exposure, tooling, throughput and production volume.
Learn when no-clean flux can remain on a PCBA and when cleaning is required for coating, appearance, reliability or customer specifications.
Compare inline and offline PCBA cleaning machines by loading method, throughput, product mix, floor space, utilities, rinsing and drying.
Send your PCB or workpiece dimensions, current production problem, required throughput and available factory utilities.
For cleaning projects, include the contamination and required cleaning result. For selective soldering projects, include the PCB drawing, THT solder-joint positions, solder alloy and flux information.
Phone: +86 138 2338 9052
Email: [email protected]
Address: 4th Floor, Building A, Hedong Industrial Zone, Xixiang, Bao’an District, Shenzhen 518126, China
