10-Zone Nitrogen Reflow Oven for SMT Production – DEZ-1000PC-N

The DEZ-1000PC-N is a nitrogen reflow oven for continuous SMT production, using 10 upper and 10 lower independently controlled hot-air heating zones, two forced-air cooling zones and a sealed nitrogen atmosphere.

It processes 50–400 mm PCBs at conveyor speeds up to 1800 mm/min and supports lead-free and lead-based soldering, including CSP, BGA, μBGA, 0201 and single- or double-sided PCB assemblies.

The DEZ-1000PC-N can be used in automotive electronics, medical device manufacturing, aerospace and defence electronics, telecommunications equipment, industrial control systems, consumer electronics, LED and power electronics, and EMS & contract manufacturing when the PCB assembly process requires controlled nitrogen reflow, repeatable thermal profiling or tighter oxidation control.

For EMS and high-mix production in particular, recipe storage, production records and profile testing help manage different PCB assemblies with different soldering requirements.

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Why Use Nitrogen Reflow Soldering?

For many PCB assemblies, standard air reflow is sufficient. The problem appears when oxidation begins to affect solder wetting or reduces the acceptable process window.

The DEZ-1000PC-N uses a fully enclosed furnace with nitrogen flow control and real-time oxygen monitoring. Nitrogen enters the machine at ≥0.5 MPa pressure and ≥99.999% purity. The oxygen concentration can reach approximately 150 PPM, while optional closed-loop control supports adjustment from 50–200 PPM.

Large components, BGAs, copper-heavy areas and small passive components do not absorb heat at the same rate. The DEZ-1000PC-N uses separate upper and lower hot-air circulation loops. All heating zones are independently controlled and can be activated individually, allowing the thermal profile to be adjusted according to PCB structure and component distribution.

Different PCB assemblies normally require different conveyor speeds, temperature settings and thermal profiles. The control system can save process settings, production records and measured temperature-profile data for different PCB models. Alarm events and operating records are also stored for production review and troubleshooting.

10-Zone Nitrogen Reflow Oven DEZ-1000PC-N Working

1000PC-N Nitrogen Reflow Oven Features

Controlled Nitrogen Atmosphere

Closed-loop nitrogen control and online oxygen monitoring provide a controlled low-oxygen environment for demanding SMT reflow processes.

Stable Thermal Control

Temperature control accuracy reaches ±1°C, with no-load to full-load fluctuation within ±2°C.

High-Speed Inline Production

Normal production conveyor speed reaches 1500 mm/min for continuous SMT assembly lines.

Flux Recovery & Forced Cooling

Multi-point flux collection reduces maintenance requirements, while two-stage forced-air cooling controls PCBA outlet temperature.
Reflow Oven for SMT Production Multiple sets of rollers

Nitrogen Reflow Oven Working Process

Solder Paste Printing → Component Placement → Preheat → Soak → Reflow → Forced Cooling → Inspection
During production, the conveyor moves the PCBA through the programmed heating profile while the sealed furnace maintains the required nitrogen atmosphere.
After peak reflow, the PCB passes through two forced-air cooling zones before leaving the machine for AOI, manual inspection or downstream handling.
The standard transport system combines chain drive, mesh belt and guide rails, with left-to-right transport standard and right-to-left available according to line configuration.

1000PC-N Nitrogen Reflow Oven Technical Specifications

SpecificationDEZ-1000PC-N
ModelDEZ-1000PC-N
Equipment TypeNitrogen Reflow Oven
Heating Zones10 upper + 10 lower
Heating MethodPressurised hot-air circulation
Heating Zone Length3860 mm
Cooling Zones2 forced-air zones
Standard Cooling Length600 mm
Optional Cooling ConfigurationDouble-sided cooling, up to 1100 mm
PCB Size50–400 mm
Guide-Rail Width Range50–380 mm
Mesh Belt Width500 mm
Maximum Component Height25 mm
Conveyor Speed0–1800 mm/min
Normal Production SpeedUp to approx. 1500 mm/min
Conveyor Speed Deviation±2%
Conveyor Height900 ±20 mm
Transport DirectionL→R; R→L optional
Transport ModeChain + mesh belt + guide rails
Temperature Setting RangeAmbient to 320°C
Heating Zone Adjustment Range0–300°C
Temperature ControlPID + SSR
Temperature Accuracy±1°C setpoint-to-actual; detailed static specification ±1–2°C
No-Load to Full-Load Fluctuation±2°C
Temperature Ramp Capability3°C/s
Warm-Up TimeApprox. 20 min
Temperature Profiling3-channel online profile test
Applicable SolderLead-free / lead-based
Supported PackagesCSP, BGA, μBGA, 0201
Nitrogen Working Pressure≥0.5 MPa
Nitrogen Purity≥99.999%
Stated Oxygen ConcentrationDown to approx. 150 PPM
Optional Oxygen Control50–200 PPM
Power Supply3-phase, 380 V, 50 Hz
Startup Power62 kW
Operating PowerApprox. 11 kW
Machine Dimensions5800 × 1300 × 1550 mm
Net WeightApprox. 2300 kg

We are Proud to Partner with These Brands

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DEZ-SMT-Partner-BAE-SYSTEMS DEZ-SMT-Partner-Dextra DEZ-SMT-Partner-eolane DEZ-SMT-Partner-Foxconn DEZ-SMT-Partner-IMI DEZ-SMT-Partner-JABIL DEZ-SMT-Partner-LACROIX DEZ-SMT-Partner-Laudren-Electronique DEZ-SMT-Partner-LEAB DEZ-SMT-Partner-MULTILASEr DEZ-SMT-Partner-RENISHAW DEZ-SMT-Partner-SANMINA DEZ-SMT-Partner-UNIVERSAL DEZ-SMT-Partner-Visteon

Heating, Conveyor and Machine Design

1. Independent Heating for Profile Adjustment
The 3860 mm heating section features 10 independently controlled upper zones and 10 independently controlled lower zones. Each zone can be switched on or off, allowing engineers to fine-tune the heating profile according to different PCB requirements.
2. Efficient Heating and Warm-Up
Heating starts from the middle section and gradually extends toward both ends. This design helps reduce heat loss during warm-up and shortens the time required to reach thermal equilibrium. The machine reaches operating temperature in approximately 20 minutes.
3. Separate Hot-Air Circulation
Hot-air circulation is independently separated between the upper and lower sides of the PCB. This improves thermal compensation when PCB thickness, component size, or thermal mass varies across different assemblies.
4. Stable Conveyor Control
Conveyor speed is controlled by a computer-based closed-loop system, with a specified speed deviation of within ±2%. Automatic chain lubrication and a three-point synchronous width-adjustment mechanism help maintain stable PCB transport through the heated section.
5. Precision Rail and High-Temperature Transport
Guide-rail adjustment accuracy is specified at better than 0.2 mm, while thermal-compensation structures help maintain rail parallelism as furnace temperature changes. A 500 mm Grade 316 stainless-steel mesh belt provides reliable, high-temperature continuous transport.
6. Flexible Width Adjustment and Reliable Operation
Manual width adjustment is standard, with motorised width adjustment available as an option. Together, these design features help address common production issues such as PCB jamming, rail deformation, and unstable transport through a long heated process.

1000PC-N Nitrogen Reflow Oven Machine Design

Nitrogen Reflow Oven Nitrogen Protection

Control, Cooling and Production Protection

The machine uses an industrial PC with a Siemens PLC. The control system monitors machine status, records daily operating logs and stores production information for different PCB recipes.

Two forced-air cooling zones remove heat after solder reflow. The standard cooling section is 600 mm, while the source also specifies an optional double-sided configuration with cooling length up to 1100 mm.

The system monitors conditions including power abnormalities, conveyor-speed faults, motor faults, guide-rail travel limits, over-temperature, under-temperature and thermocouple open circuits.
Reflow and SMT Production

Construction and Maintenance Access

The machine uses an industrial rectangular steel frame with a 2 mm steel outer enclosure. Front and rear sections use enclosed removable doors to provide access for maintenance.

The upper furnace body opens by an electric screw-jack mechanism with mechanical support protection, allowing access to the heating chamber without manually lifting the complete upper section.

The inner furnace uses a stainless-steel chamber with multi-layer thermal insulation. The machine also includes adjustable levelling feet and casters for installation, positioning and horizontal adjustment.

The multi-point flux recovery design is intended to reduce the amount of process residue remaining inside the furnace and reduce cleaning frequency.

Main Electrical and Mechanical Components

ComponentBrandOrigin
Solid-State RelayCarlo GavazziSwitzerland
Thermal Overload RelaySchneider ElectricFrance
Thermal Relay SocketSchneider ElectricFrance
UPSSantakUSA
AC ContactorChintChina
PLCSiemensGermany
Temperature Control ModuleSiemensGermany
Heating WireHotsetGermany
Variable-Frequency DriveDelta ElectronicsTaiwan
Timer RelayOMRONJapan
Phase-Sequence ProtectorSchneider ElectricFrance
Solenoid ValveSMCJapan
Transport MotorPanasonicJapan
High-Temperature MotorSanyueTaiwan
Industrial PCGreat WallChina
Transport Gear ReducerPanasonicJapan
Mesh BeltTsubakimotoJapan
Conveyor ChainKMCTaiwan
Rotary EncoderOMRONJapan
Photoelectric SensorOMRONJapan

FAQs by 10-Zone Nitrogen Reflow Oven

What PCB size can the DEZ-1000PC-N process?

The stated PCB size is 50–400 mm, while the chain guide-rail adjustment range is 50–380 mm. Boards near the maximum stated size should be confirmed against the selected transport configuration.

The conveyor setting range is 0–1800 mm/min. The product characteristics state that normal production chain speed can reach approximately 1500 mm/min.

Incoming nitrogen requires at least 0.5 MPa working pressure and 99.999% purity. For more details, please refer to our nitrogen generator.

The specification states that oxygen concentration can reach approximately 150 PPM. Optional closed-loop control provides an adjustable 50–200 PPM range.

The machine includes a 3-channel online profiling system. It records temperature and ramp-rate data and allows measured profiles and process settings to be saved for analysis.

The built-in UPS and delayed shutdown system allow PCBs to continue moving out of the heated furnace during an unexpected power failure, reducing the risk of boards remaining inside a high-temperature zone.

Yes. The machine uses chain, mesh-belt and guide-rail transport with a standard working height of 900 ±20 mm and is designed for inline connection with automatic SMT equipment.

Yes. The control system records process parameters and production data for different PCB models, and the built-in profile function stores measured thermal-profile information for later analysis.

Send Your SMT Equipment Requirements

Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.

Send your workpiece dimensions, production problem and required throughput to receive a free application review, equipment recommendation and project quotation. Free sample testing is available for qualified projects.

An equipment specialist will contact you within one hour during business hours.

Get a Free Recommendation and Request Sample Testing
Email: [email protected]
Phone: +86 138 2338 9052

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