The DEZ-R800PC is a continuous SMT reflow oven designed for reliable PCB assembly soldering. With eight upper and eight lower hot-air heating zones, a 3140 mm heating section, temperature control up to 320°C, and three-channel online profiling, it supports both lead-free and leaded soldering while providing controlled preheating, soaking, reflow and cooling.
The DEZ-R800PC addresses common SMT soldering challenges, including uneven PCB heating, unstable reflow profiles, demanding lead-free soldering, uncontrolled cooling and PCB risks during power interruptions.
Independent zone control, upper and lower hot-air circulation, two cooling zones and UPS conveyor protection help deliver consistent soldering results, controlled cooling and safer continuous production.
| Item | Specification |
|---|---|
| Model | DEZ-R800PC |
| Machine type | Inline hot-air reflow oven |
| Heating zones | 8 upper and 8 lower |
| Heating method | Hot-air circulation |
| Heating length | 3140 mm |
| Cooling zones | 2 |
| Maximum cooling rate | Up to 5°C/s |
| Temperature range | Room temperature to 320°C |
| Static temperature precision | ±1–2°C |
| Conveyor method | Mesh belt and chain |
| Conveyor direction | Left to right; right to left optional |
| Conveyor speed | 0–1.8 m/min |
| Conveyor height | 900 ± 20 mm |
| PCB height limit | 25 mm |
| Temperature control | PLC and SSR |
| Profile testing | Three-channel online profiling |
| Suitable solder | Lead-free and leaded solder |
| Power supply | AC 380 V, three-phase, 50 Hz |
| Start-up power | 36 kW |
| Working power | Approximately 8 kW |
| Warm-up time | Approximately 20 minutes |
| Machine dimensions | 5600 × 1350 × 1500 mm |
| Net weight | Approximately 2000 kg |
We have worked with
It melts solder paste and forms solder joints between surface-mount components and PCB pads.
Yes. The temperature can be set up to 320°C for lead-free and leaded soldering processes.
The machine has eight upper and eight lower hot-air heating zones.
Yes. It supports PCB assemblies containing CSP, BGA, μBGA and 0201 components.
Yes. The integrated three-channel system measures PCB temperature and heating rate.
The UPS protection system helps the conveyor move PCB assemblies out of the heated chamber.
Yes. The conveyor direction and transport height can be configured to match the surrounding SMT equipment.
Contact DEZ for PCBA cleaning machine, selective soldering machine, stencil cleaning machines, X-ray inspection, BGA rework, reflow ovens and SMT handling equipment.
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