The DEZ-R1000PC is a hot-air SMT reflow oven designed for lead-free soldering and continuous PCB assembly. It combines 10 upper and 10 lower heating zones with 2 forced-air cooling zones to provide stable, uniform thermal control throughout the reflow process. With a maximum PCB width of 400 mm and conveyor speeds of up to 2000 mm/min, the DEZ-R1000PC is suitable for a wide range of SMT production lines. Mesh-belt and chain conveyor options are available to meet different production requirements. 20 Heating Zones | 2 Cooling Zones | 400 mm PCB Width | 3-Channel Profiling
The DEZ-R1000PC heats PCB assemblies according to a programmed reflow profile, allowing deposited solder paste to preheat, activate, reflow and cool under controlled conditions.
The temperature setting range extends from room temperature to 300°C. Independent upper and lower hot-air circulation provides temperature control across different PCB sizes and component layouts.
The conveyor transports PCBs through the complete solder reflow process at speeds up to 2000 mm/min. The standard transport direction is left to right. Right-to-left transport and rear-fixed rail configuration are available when required by the production-line layout.
| Parameter | DEZ-R1000PC |
|---|---|
| Machine type | SMT hot-air reflow oven |
| Soldering process | Lead-free reflow soldering |
| Number of heating zones | 10 upper and 10 lower |
| Heating-section length | 3890 mm |
| Heating method | Hot-air convection |
| Number of cooling zones | 2, upper and lower cooling |
| Cooling method | Forced-air cooling |
| Cooling rate | 3.5–6°C/s |
| Exhaust requirement | 10 m³/min × 2 |
| Maximum PCB width | 400 mm |
| Mesh-belt width | 500 mm |
| Conveyor type | Mesh belt and chain |
| Conveyor direction | Left to right; right to left optional |
| Conveyor height | 900 ±20 mm |
| Rail-width range | Up to 400 mm |
| Conveyor speed | 0–2000 mm/min |
| Fixed rail | Front fixed; rear-fixed option |
| Component clearance | 25 mm above and below |
| Chain lubrication | Automatic and manual |
| Temperature-setting range | Room temperature to 300°C |
| Temperature-control method | PID closed-loop control with SSR |
| Temperature-control accuracy | ±1°C |
| PCB temperature deviation | ±2°C |
| Warm-up time | Approximately 20 minutes |
| Control system | Industrial PC and Siemens PLC |
| Operating interface | Windows |
| Online profiling | Three thermocouple channels |
| Data storage | 80 GB |
| Nozzle-plate material | Aluminium alloy |
| Installed power | 42 kW |
| Normal power consumption | 8–10 kW |
| Power supply | AC 380 V, three-phase, five-wire, 50/60 Hz |
| Machine dimensions | L5800 × W1320 × H1490 mm |
| Machine weight | Approximately 2100 kg |
| Standard colour | Computer grey |
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A reflow oven heats a PCB assembly according to a controlled temperature profile so that deposited solder paste melts, forms solder joints and then cools.
It has 10 upper and 10 lower heating zones. Upper and lower temperatures are controlled independently.
Yes. Its temperature-setting range extends to 300°C for compatible lead-free soldering profiles.
The maximum specified PCB width is 400 mm. The mesh belt is 500 mm wide.
The operator enters the required zone temperatures and conveyor speed through the Windows interface. The actual PCB curve is then checked using the built-in three-channel profiler.
A separate profiler is not required for routine three-channel profile measurement. The machine can measure, store and print the actual PCB temperature curve.
The conveyor is adjustable from 0 to 2000 mm/min.
The specified warm-up time is approximately 20 minutes.
The temperature-setting range extends from room temperature to 300°C.
The PCB passes through two upper and lower forced-air cooling zones after reflow. The specified cooling-rate range is 3.5–6°C/s.
It provides 25 mm component clearance above and below the PCB. The board structure and transport edges must be checked against the mesh or chain conveyor configuration.
The Siemens PLC supports offline machine operation if the industrial PC becomes unavailable.
Yes. Provide the line height, conveyor direction, fixed rail side, communication requirements and adjacent equipment before production.
Send your PCB dimensions, component layout, solder paste specification, target output and existing SMT line information.
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