Double-Sided PCB Cleaning Machine DEZ-C753S removes dust, fibers, loose particles and static from both sides of bare PCBs before solder paste printing.
Brushes loosen surface contamination. Ionized air reduces static, vacuum sections extract released particles, and sticky rollers collect remaining contamination before the PCB enters the printer.
The machine processes bare PCBs from 50 × 50 mm to 350 × 350 mm with a thickness of 0.4–3 mm. It supports left-to-right or right-to-left transfer and connects with standard SMT production equipment at a conveyor height of 900 ±25 mm.
It is used for bare PCBs before solder paste printing and component placement.
No. Post-solder flux residue requires a dedicated PCBA cleaning process.
The system removes dry surface contamination such as dust, fibers and loose particles. It also reduces static before particle collection.
Yes. The DEZ-C753S is configured to clean the upper and lower surfaces of the bare PCB.
It is normally installed after the PCB loader and before the solder paste printer.
No. The DEZ-C753S uses brushes, ionized air, vacuum extraction and sticky rollers for dry PCB surface cleaning.
PCB surface cleaning is completed before solder paste printing. Different equipment is required for stencil cleaning, post-solder flux cleaning, PCBA inspection and other production stages.
Explore all DEZ applications for bare PCB cleaning, PCBA flux cleaning, stencil cleaning, selective soldering, reflow soldering, X-ray inspection, BGA rework and SMT line handling.
Send us the PCBA dimensions, soldering method, flux information, component layout, contaminated areas, production volume and required cleaning result.
PCBAs containing actual post-solder residue can be tested before machine selection. DEZ will evaluate whether the application requires single-sided cleaning, offline batch cleaning or continuous inline cleaning.
We share our SMT manufacturing expertise to help you optimize soldering, PCBA cleaning, inspection, and production efficiency.
