{"id":5364,"date":"2026-09-25T11:17:00","date_gmt":"2026-09-25T19:17:00","guid":{"rendered":"https:\/\/dez-smt.com\/?p=5364"},"modified":"2026-10-07T06:59:24","modified_gmt":"2026-10-07T14:59:24","slug":"what-is-pcb-ionic-contamination","status":"publish","type":"post","link":"https:\/\/dez-smt.com\/it\/what-is-pcb-ionic-contamination\/","title":{"rendered":"Cos'\u00e8 la contaminazione ionica del PCB e in che modo \u00e8 diversa dai residui visibili?"},"content":{"rendered":"\n

Ionic contamination is soluble charged material remaining on a PCB or PCBA after fabrication, soldering, handling or cleaning. It may include chloride, bromide, sodium, potassium, sulphate, nitrate and organic-acid ions.<\/p>\n\n\n\n

These contaminants are often present at concentrations that cannot be seen. When moisture dissolves them, they can increase surface conductivity and contribute to leakage, corrosion or electrochemical migration under electrical bias.<\/p>\n\n\n\n

Visible residue describes what can be seen rather than how it behaves chemically. Flux films, white deposits, dust, fibres, fingerprints, oils and solder balls are all visible residue, but they are not automatically ionic or non-ionic.<\/p>\n\n\n\n

Ionic Contamination vs Visible Residue<\/strong><\/h2>\n\n\n\n
Comparison<\/th>Ionic contamination<\/th>Visible residue<\/th><\/tr>
Definition<\/td>Soluble charged species on the assembly<\/td>Contamination detected visually or under magnification<\/td><\/tr>
Visibility<\/td>Frequently invisible<\/td>Visible directly, by camera or under a microscope<\/td><\/tr>
Examples<\/td>Chloride, bromide, sodium, potassium and organic-acid ions<\/td>Flux films, white deposits, fibres, oils, dust and solder balls<\/td><\/tr>
Electrical behaviour<\/td>Can increase conductivity when dissolved in moisture<\/td>Depends on composition; it may be conductive, insulating or contain ions<\/td><\/tr>
Main concern<\/td>Leakage, corrosion and electrochemical migration<\/td>Appearance, inspection, contact, coating, bonding or particle-related problems<\/td><\/tr>
Verification<\/td>ROSE, ion chromatography, SIR or another defined test<\/td>Visual or optical inspection<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

Visible residue should not be described as harmless merely because it appears non-metallic. Flux films and fingerprints may contain ionic material, while metal particles and solder balls may create electrical risks without being measured as ionic contamination.<\/p>\n\n\n\n

How Ionic Contamination Becomes an Electrical Risk<\/strong><\/h2>\n\n\n\n

Ionic contamination does not automatically produce a short circuit. The risk develops through the interaction of contamination, moisture, electrical bias, conductor spacing and time.<\/p>\n\n\n\n

When moisture forms a thin film on the assembly, soluble ions enter the liquid and increase its conductivity. This can reduce surface insulation resistance and create leakage between conductors.<\/p>\n\n\n\n

Under continuing electrical bias, metal may dissolve at one conductor, migrate through the electrolyte and deposit elsewhere. This electrochemical migration can form dendrites and eventually create an unintended conductive path.<\/p>\n\n\n\n

\"Dendrite-growth-caused-by-flux-residue\"<\/div>\n\n\n\n

A contaminated assembly may therefore pass dry factory testing but behave differently after exposure to humidity, condensation or temperature cycling.<\/p>\n\n\n\n

Where Ionic Contamination Comes From<\/strong><\/h2>\n\n\n\n

The likely source depends on when the contamination appears.<\/p>\n\n\n\n

Process stage<\/th>Possible source<\/th>What to check<\/th><\/tr>
Bare-board fabrication<\/td>Etching, plating, surface finishing or insufficient rinsing<\/td>Supplier process data and incoming-board cleanliness<\/td><\/tr>
Reflow soldering<\/td>Solder-paste activators and reaction products<\/td>Paste type, applied volume and thermal profile<\/td><\/tr>
Wave or selective soldering<\/td>Liquid flux, excessive application or insufficient preheating<\/td>Flux quantity, spray pattern, preheat and soldering parameters<\/td><\/tr>
Manual soldering or rework<\/td>Locally applied flux and repeated heating<\/td>Flux product, application method and number of rework cycles<\/td><\/tr>
Cleaning and rinsing<\/td>Contaminated wash solution, cleaner carryover or poor rinse water<\/td>Chemistry concentration, bath condition and DI-water quality<\/td><\/tr>
Handling<\/td>Fingerprints and perspiration<\/td>Gloves, handling method and exposed test areas<\/td><\/tr>
Drying and storage<\/td>Trapped moisture or environmental contamination<\/td>Drying result, packaging and storage conditions<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

How Is Ionic Contamination Detected?<\/strong><\/h2>\n\n\n\n

The test method should be selected according to the question that must be answered.<\/p>\n\n\n\n

Method<\/th>What it tells you<\/th>Main limitation<\/th><\/tr>
Visual inspection<\/td>Whether accessible residue, particles, water marks or corrosion are visible<\/td>Cannot prove ionic cleanliness<\/td><\/tr>
ROSE<\/td>The bulk level of extractable ionic contamination<\/td>Does not identify individual ions or their location<\/td><\/tr>
Ion chromatography<\/td>Which ionic species are present and their measured quantities<\/td>Result depends on the extraction area and procedure<\/td><\/tr>
SIR<\/td>How a representative process behaves under defined humidity, temperature and electrical bias<\/td>Does not identify the specific contaminant<\/td><\/tr>
Localised extraction<\/td>Whether a particular component or process area contains concentrated contamination<\/td>Does not represent the complete assembly unless sampling is planned correctly<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n
\"\"<\/div>\n\n\n\n

What Is an Acceptable Ionic-Contamination Level?<\/strong><\/h2>\n\n\n\n

There is no universal value that proves every assembly is reliable.<\/p>\n\n\n\n

A valid acceptance requirement must define the test method, extraction conditions, calculated surface area, units, sampling plan and pass\/fail limit.<\/p>\n\n\n\n

The historical value of 1.56 \u00b5g NaCl equivalent\/cm\u00b2 should not automatically be used as a universal qualification limit. IPC removed it as the default basis for qualifying a manufacturing process when IPC J-STD-001H was introduced.<\/p>\n\n\n\n

The applicable limit should come from the customer specification, product requirement or qualified manufacturing process.<\/p>\n\n\n\n

How Should the Cleaning Process Be Selected?<\/strong><\/h2>\n\n\n\n

The first decision is whether the requirement concerns visible residue, ionic contamination or both.<\/p>\n\n\n\n

Visible Residue on an Accessible Surface<\/h3>\n\n\n\n

Brush or dry ice cleaning may be suitable when the main requirement is to remove accessible flux marks, solder balls or local rework residue.<\/p>\n\n\n\n

The Automatic Single-Sided PCBA Cleaning Machine \u2013 DEZ-C758<\/a> and Automatic PCBA Brush Cleaning Machine \u2013 DEZ-C760<\/a> clean one accessible solder-side surface.<\/p>\n\n\n\n

DEZ dry ice cleaning machines<\/a> provide waterless cleaning for compatible exposed flux and rework residue. The range includes the fixed-station DEZ-C7310, inline DEZ-C7320 and portable DEZ-C1650.<\/p>\n\n\n\n

These processes can remove residue containing ionic material, but visible removal does not prove that an ionic-cleanliness limit has been achieved.<\/p>\n\n\n\n

Ionic Contamination Requiring Full Washing and Rinsing<\/h3>\n\n\n\n

When the complete assembly requires chemical washing, DI-water rinsing and controlled drying, use a validated aqueous process.<\/p>\n\n\n\n

The main sequence is:<\/p>\n\n\n\n

Compatible Chemical Wash \u2192 DI-Water Rinse \u2192 Controlled Drying \u2192 Cleanliness Test<\/p>\n\n\n\n

The cleaning chemistry performs the main washing action. DI water removes dissolved contamination and remaining cleaning agent after washing.<\/p>\n\n\n\n

DI water should not be described as the primary flux-cleaning stage.<\/p>\n\n\n\n

DEZ Equipment for Ionic-Contamination Control<\/strong><\/h2>\n\n\n\n
Production requirement<\/th>Recommended equipment<\/th>Relevant process data<\/th><\/tr>
High-mix offline batch cleaning<\/td>Offline PCBA Cleaning Machine \u2013 DEZ-C743<\/a><\/td>Spray washing, DI-water rinsing and hot-air drying; double-layer 610 \u00d7 560 \u00d7 100 mm basket; maximum 10 kg batch load; wash temperature 25\u201375\u00b0C<\/td><\/tr>
Continuous inline aqueous cleaning<\/td>Inline PCBA Cleaning Machine \u2013 DEZ-C1360<\/a><\/td>Chemical washing, DI-water rinsing and two-zone hot-air drying; supports products 50\u2013500 mm wide; conveyor speed up to 1000 mm\/min<\/td><\/tr>
Dedicated DI rinse-water supply<\/td>Deionized Water System \u2013 DEZ-CS300<\/a><\/td>Produces DI water for compatible rinse processes; required output and storage must match actual machine demand<\/td><\/tr>
Accessible visible solder-side residue<\/td>DEZ-C758 or DEZ-C760<\/td>Brush cleaning without complete chemical washing and DI-water rinsing<\/td><\/tr>
Accessible local residue without liquid cleaning<\/td>DEZ-C7310, DEZ-C7320 or DEZ-C1650<\/td>Dry ice cleaning; ionic cleanliness must be verified separately<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

Neither the machine name nor the cleaning method proves compliance. The completed process must be tested using the specified cleanliness method.<\/p>\n\n\n\n

See the PCBA flux residue and ionic contamination cleaning application<\/a> for the complete selection route.<\/p>\n\n\n\n

How to Validate the Cleaning Result<\/h2>\n\n\n\n

Start with representative assemblies carrying actual production contamination. Record the flux, soldering process, residue location, cleaning chemistry and current test result.<\/p>\n\n\n\n

Clean the samples using controlled parameters, then repeat the same inspection and ionic test. This establishes whether the process removes the target contamination instead of merely improving appearance.<\/p>\n\n\n\n

For aqueous cleaning, confirm wash chemistry, DI-water quality, rinse effectiveness and drying. For brush or dry ice cleaning, confirm access to the contaminated area and test ionic cleanliness separately when required.<\/p>\n\n\n\n

Once the result is acceptable, define the process settings, bath-maintenance limits, sampling frequency and conditions that require requalification.<\/p>\n\n\n\n

Frequently Asked Questions<\/strong><\/h2>\n\n\n\n

Does visible flux residue mean ionic contamination is too high?<\/h3>\n\n\n\n

Not necessarily. Appearance cannot determine the type or quantity of ionic contamination. Test the assembly against the specified requirement.<\/p>\n\n\n\n

Does passing ROSE prove reliability?<\/h3>\n\n\n\n

No. ROSE is a process-control method. Product qualification may also require ion chromatography, SIR, electrical testing or environmental evaluation.<\/p>\n\n\n\n

Can DI water alone remove all ionic contamination?<\/h3>\n\n\n\n

No. Some contamination is trapped inside flux or other residue and first requires a compatible cleaning agent. DI water is then used to rinse away dissolved contamination and remaining cleaner.<\/p>\n\n\n\n

Can dry ice cleaning remove ionic contamination?<\/h3>\n\n\n\n

Dry ice can remove accessible residue containing ionic material, but it does not provide a complete dissolution and DI-water rinsing process. Test the cleaned assembly when ionic cleanliness is specified.<\/p>\n\n\n\n

Evaluate Your Cleaning Process<\/strong><\/h2>\n\n\n\n

Send DEZ representative samples, residue photographs, flux information, cleaning-process data and the required test method.<\/p>\n\n\n\n

DEZ can evaluate whether the application requires accessible brush cleaning, local dry ice cleaning, offline batch aqueous cleaning or continuous inline aqueous cleaning.<\/p>\n\n\n\n

View DEZ PCB cleaning machines<\/a> or all DEZ SMT equipment<\/a>.<\/p>\n\n\n