{"id":4185,"date":"2026-08-19T22:32:56","date_gmt":"2026-08-20T06:32:56","guid":{"rendered":"https:\/\/dez-smt.com\/?p=4185"},"modified":"2026-08-26T11:23:45","modified_gmt":"2026-08-26T19:23:45","slug":"x-ray-inspection-for-bga-and-hidden-solder-joints","status":"publish","type":"post","link":"https:\/\/dez-smt.com\/es\/x-ray-inspection-for-bga-and-hidden-solder-joints\/","title":{"rendered":"Inspecci\u00f3n por Rayos X para Juntas BGA y Juntas de Soldadura Ocultas"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\">BGA, QFN, LGA and CSP solder joints are located beneath the component package. Once soldering is complete, these connections cannot be fully inspected with a camera or microscope.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray inspection creates an internal image of the package, solder joints, pads and other structures without dismantling the PCB assembly.<\/p>\n\n\n\n<div class=\"wp-block-rank-math-toc-block\" id=\"rank-math-toc\"><h2>Table of Contents<\/h2><nav><ul><li><a href=\"#why-visual-inspection-is-not-enough\">Why Visual Inspection Is Not Enough<\/a><\/li><li><a href=\"#what-x-ray-inspection-can-detect\">What X-Ray Inspection Can Detect<\/a><ul><li><a href=\"#voids\">Voids<\/a><\/li><li><a href=\"#solder-bridges\">Solder Bridges<\/a><\/li><li><a href=\"#insufficient-solder\">Insufficient Solder<\/a><\/li><li><a href=\"#excess-solder\">Excess Solder<\/a><\/li><li><a href=\"#missing-solder-joints\">Missing Solder Joints<\/a><\/li><li><a href=\"#package-misalignment\">Package Misalignment<\/a><\/li><li><a href=\"#irregular-ball-shape\">Irregular Ball Shape<\/a><\/li><\/ul><\/li><li><a href=\"#how-bga-x-ray-inspection-works\">How BGA X-Ray Inspection Works<\/a><\/li><li><a href=\"#inspect-the-complete-bga-pattern\">Inspect the Complete BGA Pattern<\/a><\/li><li><a href=\"#compare-similar-solder-joints\">Compare Similar Solder Joints<\/a><\/li><li><a href=\"#x-ray-inspection-after-reflow\">X-Ray Inspection After Reflow<\/a><\/li><li><a href=\"#x-ray-inspection-after-bga-rework\">X-Ray Inspection After BGA Rework<\/a><\/li><li><a href=\"#x-ray-inspection-does-not-replace-other-tests\">X-Ray Inspection Does Not Replace Other Tests<\/a><\/li><li><a href=\"#when-should-bga-joints-be-inspected\">When Should BGA Joints Be Inspected?<\/a><ul><li><a href=\"#first-production\">First Production<\/a><\/li><li><a href=\"#reflow-profile-changes\">Reflow Profile Changes<\/a><\/li><li><a href=\"#process-failure-analysis\">Process Failure Analysis<\/a><\/li><li><a href=\"#bga-rework\">BGA Rework<\/a><\/li><li><a href=\"#process-monitoring\">Process Monitoring<\/a><\/li><\/ul><\/li><li><a href=\"#selecting-a-pcba-x-ray-inspection-system\">Selecting a PCBA X-Ray Inspection System<\/a><\/li><li><a href=\"#dez-x7600-pcba-x-ray-inspection-system\">DEZ-X7600 PCBA X-Ray Inspection System<\/a><\/li><li><a href=\"#x-ray-inspection-and-bga-rework\">X-Ray Inspection and BGA Rework<\/a><\/li><li><a href=\"#request-an-x-ray-inspection-test\">Request an X-Ray Inspection Test<\/a><\/li><\/ul><\/nav><\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"why-visual-inspection-is-not-enough\" class=\"wp-block-heading\">Why Visual Inspection Is Not Enough<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Visual inspection can confirm component position, polarity and visible solder joints. It cannot show the complete solder structure beneath a bottom-terminated package.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">A BGA may appear correctly positioned while containing voids, bridges, insufficient solder or missing connections underneath. These defects may cause immediate functional failure or intermittent problems during operation.<\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-7ed9adb\" id=\"gspb_image-id-gsbp-7ed9adb\"><img decoding=\"async\" src=\"https:\/\/dez-smt.com\/wp-content\/uploads\/2026\/08\/Optical-Alignment-System-Integrating-High-Precision-CCD.webp\" data-src=\"\" alt=\"Optical Alignment System Integrating High Precision CCD\" loading=\"lazy\" width=\"1200\" height=\"675\"\/><\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"what-x-ray-inspection-can-detect\" class=\"wp-block-heading\">What X-Ray Inspection Can Detect<\/h2>\n\n\n\n<h3 id=\"voids\" class=\"wp-block-heading\">Voids<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Voids appear as lighter areas inside the darker solder joint image. X-ray allows the operator to examine their size, number and position.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Void acceptance cannot be determined from appearance alone. The permitted level depends on the package, solder joint, customer specification and inspection method.<\/p>\n\n\n\n<h3 id=\"solder-bridges\" class=\"wp-block-heading\">Solder Bridges<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Bridges appear when solder connects two adjacent balls or pads that should remain electrically separate.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray is particularly useful when the bridge is completely hidden beneath the package.<\/p>\n\n\n\n<h3 id=\"insufficient-solder\" class=\"wp-block-heading\">Insufficient Solder<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A joint with insufficient solder may appear smaller or less dense than surrounding joints.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The operator should compare the suspect joint with other balls in the same row, package and assembly.<\/p>\n\n\n\n<h3 id=\"excess-solder\" class=\"wp-block-heading\">Excess Solder<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Excess solder can produce enlarged or irregular joint shapes. It may increase the risk of bridging or indicate inconsistent solder-paste deposition.<\/p>\n\n\n\n<h3 id=\"missing-solder-joints\" class=\"wp-block-heading\">Missing Solder Joints<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A missing ball, incomplete paste deposit or open connection may appear as an empty or irregular position within the BGA pattern.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Some open-joint conditions are difficult to prove using a single 2D image. Electrical testing or additional inspection may still be required.<\/p>\n\n\n\n<h3 id=\"package-misalignment\" class=\"wp-block-heading\">Package Misalignment<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray can show whether the BGA balls are centred over the PCB pads and whether the package shifted during reflow.<\/p>\n\n\n\n<h3 id=\"irregular-ball-shape\" class=\"wp-block-heading\">Irregular Ball Shape<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Uneven, elongated or distorted solder images may indicate movement, poor wetting, excessive solder or another process abnormality.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"how-bga-x-ray-inspection-works\" class=\"wp-block-heading\">How BGA X-Ray Inspection Works<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The PCB assembly is positioned inside the shielded inspection cabinet. The X-ray source passes radiation through the sample, while the detector records differences in material thickness and density.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Dense materials such as solder absorb more X-rays and appear darker in the image. Voids, gaps and lower-density areas appear lighter.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The operator adjusts the sample position, magnification, image contrast and X-ray settings to examine the package and individual solder joints.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"inspect-the-complete-bga-pattern\" class=\"wp-block-heading\">Inspect the Complete BGA Pattern<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Begin with a full view of the BGA to check package position and solder-ball distribution.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Compare rows, columns, corners and centre joints. Look for missing balls, bridges, inconsistent sizes and unusual density.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">After identifying a suspect area, increase the magnification and inspect the joint in relation to neighbouring solder balls.<\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-2333027\" id=\"gspb_image-id-gsbp-2333027\"><img decoding=\"async\" src=\"https:\/\/dez-smt.com\/wp-content\/uploads\/2026\/08\/BGA-Rework-Station-Adjustable-XYZ-precision.webp\" data-src=\"\" alt=\"BGA Rework Station Adjustable XYZ precision\" loading=\"lazy\" width=\"1200\" height=\"675\"\/><\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"compare-similar-solder-joints\" class=\"wp-block-heading\">Compare Similar Solder Joints<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">A single joint should not be evaluated without context.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Compare joints with similar pad size, ball size and thermal conditions. Corner, centre and ground-pad connections may produce different X-ray appearances because their copper areas and heat transfer are different.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Reference images from known-good assemblies can improve inspection consistency.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"x-ray-inspection-after-reflow\" class=\"wp-block-heading\">X-Ray Inspection After Reflow<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray inspection can be used during first-article production to confirm that the reflow process creates acceptable hidden solder joints.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">If defects are found repeatedly in the same location, review the solder-paste printing, stencil design, component placement, pad condition and reflow temperature profile.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray identifies the internal result. It does not identify the root cause automatically.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"x-ray-inspection-after-bga-rework\" class=\"wp-block-heading\">X-Ray Inspection After BGA Rework<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">A replaced BGA should be inspected after reflow to check alignment, bridging, voids and solder-ball consistency.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The usual process is:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>X-Ray Inspection \u2192 Defect Evaluation \u2192 BGA Removal \u2192 Pad Preparation \u2192 Component Alignment \u2192 Reflow \u2192 Post-Rework X-Ray Inspection<\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Electrical and functional testing should follow when required by the assembly specification.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"x-ray-inspection-does-not-replace-other-tests\" class=\"wp-block-heading\">X-Ray Inspection Does Not Replace Other Tests<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">X-ray inspection examines internal structures, but it cannot confirm every aspect of PCB assembly quality.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">It does not measure ionic contamination, prove solder-joint mechanical strength or confirm complete electrical functionality. Some defects may also require angled inspection, computed tomography, cross-section analysis or electrical testing.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Use X-ray together with visual inspection, AOI, electrical testing and functional testing according to the product requirements.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"when-should-bga-joints-be-inspected\" class=\"wp-block-heading\">When Should BGA Joints Be Inspected?<\/h2>\n\n\n\n<h3 id=\"first-production\" class=\"wp-block-heading\">First Production<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Inspect the first assemblies after setting the printing, placement and reflow process.<\/p>\n\n\n\n<h3 id=\"reflow-profile-changes\" class=\"wp-block-heading\">Reflow Profile Changes<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Repeat inspection after changing the solder paste, stencil, component, conveyor speed or temperature profile.<\/p>\n\n\n\n<h3 id=\"process-failure-analysis\" class=\"wp-block-heading\">Process Failure Analysis<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Use X-ray when functional testing indicates a possible hidden solder-joint problem.<\/p>\n\n\n\n<h3 id=\"bga-rework\" class=\"wp-block-heading\">BGA Rework<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Inspect before rework to identify the defect and after rework to verify the new solder structure.<\/p>\n\n\n\n<h3 id=\"process-monitoring\" class=\"wp-block-heading\">Process Monitoring<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Periodic inspection can detect changes in printing, placement and reflow before they affect a larger production batch.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"selecting-a-pcba-x-ray-inspection-system\" class=\"wp-block-heading\">Selecting a PCBA X-Ray Inspection System<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Start with the PCB and component dimensions, package type and defects that must be inspected.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Also confirm the required image resolution, magnification, field of view, sample positioning, image storage and production volume. Requirements for angled viewing, automated inspection or production-system connection must be specified before selecting the equipment.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The inspection requirement should determine the system configuration\u2014not magnification alone.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"dez-x7600-pcba-x-ray-inspection-system\" class=\"wp-block-heading\">DEZ-X7600 PCBA X-Ray Inspection System<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The <strong>DEZ-X7600<\/strong> is used for non-destructive inspection of BGA, QFN, LGA, CSP and other components with hidden solder connections.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">It helps operators examine voids, bridges, insufficient solder, missing connections and package misalignment during process development, production inspection and failure analysis.<\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-98a9e9d\" id=\"gspb_image-id-gsbp-98a9e9d\"><img decoding=\"async\" src=\"https:\/\/dez-smt.com\/wp-content\/uploads\/2026\/08\/PCB-X-Ray-Inspection-System-DEZ-X7600.webp\" data-src=\"\" alt=\"PCB X-Ray Inspection System DEZ-X7600\" loading=\"lazy\" width=\"1000\" height=\"1000\"\/><\/div>\n\n\n\n<p class=\"has-text-align-center wp-block-paragraph\"><a href=\"https:\/\/dez-smt.com\/product\/pcba-x-ray-inspection-system-x7600\/\" data-type=\"link\" data-id=\"https:\/\/dez-smt.com\/product\/pcba-x-ray-inspection-system-x7600\/\">View DEZ-X7600 X-Ray Inspection System<\/a><\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"x-ray-inspection-and-bga-rework\" class=\"wp-block-heading\">X-Ray Inspection and <a href=\"https:\/\/dez-smt.com\/bga-rework-stations\/\">BGA Rework<\/a><\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">When inspection confirms that a package must be replaced, DEZ provides two BGA rework configurations.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The <strong>DEZ-R820 Semi-Automatic BGA Rework Station<\/strong> uses controlled heating and optical alignment for BGA, QFN and CSP replacement.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The <strong>DEZ-R880A Automatic BGA Rework Station<\/strong> adds servo-controlled movement, optical alignment and programmable heating for automated rework operations.<\/p>\n\n\n\n<div class=\"wp-block-greenshift-blocks-row gspb_row gspb_row-id-gsbp-6eb5e91\" id=\"gspb_row-id-gsbp-6eb5e91\"><div class=\"gspb_row__content\"> \n<div class=\"wp-block-greenshift-blocks-row-column gspb_row__col--6 gspb_col-id-gsbp-073abf7\" id=\"gspb_col-id-gsbp-073abf7\">\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-672e1b2\" id=\"gspb_image-id-gsbp-672e1b2\"><img decoding=\"async\" src=\"https:\/\/dez-smt.com\/wp-content\/uploads\/2026\/08\/Optical-BGA-Rework-Station-DEZ-R820.webp\" data-src=\"\" alt=\"Optical BGA Rework Station DEZ-R820\" loading=\"lazy\" width=\"1000\" height=\"1000\"\/><\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-row-column gspb_row__col--6 gspb_col-id-gsbp-343e414\" id=\"gspb_col-id-gsbp-343e414\">\n<div class=\"wp-block-greenshift-blocks-image gspb_image gspb_image-id-gsbp-b8efa8b\" id=\"gspb_image-id-gsbp-b8efa8b\"><img decoding=\"async\" src=\"https:\/\/dez-smt.com\/wp-content\/uploads\/2026\/08\/Automatic-BGA-Rework-Station-DEZ-R880A-1.webp\" data-src=\"\" alt=\"Automatic BGA Rework Station DEZ R880A 1\" loading=\"lazy\" width=\"1000\" height=\"1000\"\/><\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"request-an-x-ray-inspection-test\" class=\"wp-block-heading\">Request an X-Ray Inspection Test<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Send the PCB dimensions, package type, component size and defect to be inspected. Sample PCBAs and existing X-ray images can be used to evaluate the inspection requirement.<\/p>\n\n\n<style id=\"wpforms-css-vars-95-block-9d3ba3ac-f5d2-4706-87d1-9a7f26f90be6\">\n\t\t\t\t#wpforms-95.wpforms-block-9d3ba3ac-f5d2-4706-87d1-9a7f26f90be6 {\n\t\t\t\t--wpforms-field-size-input-height: 43px;\n--wpforms-field-size-input-spacing: 15px;\n--wpforms-field-size-font-size: 16px;\n--wpforms-field-size-line-height: 19px;\n--wpforms-field-size-padding-h: 14px;\n--wpforms-field-size-checkbox-size: 16px;\n--wpforms-field-size-sublabel-spacing: 5px;\n--wpforms-field-size-icon-size: 1;\n--wpforms-label-size-font-size: 16px;\n--wpforms-label-size-line-height: 19px;\n--wpforms-label-size-sublabel-font-size: 14px;\n--wpforms-label-size-sublabel-line-height: 17px;\n--wpforms-button-size-font-size: 17px;\n--wpforms-button-size-height: 41px;\n--wpforms-button-size-padding-h: 15px;\n--wpforms-button-size-margin-top: 10px;\n--wpforms-container-shadow-size-box-shadow: 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