{"id":3919,"date":"2026-08-04T06:35:52","date_gmt":"2026-08-04T14:35:52","guid":{"rendered":"https:\/\/dez-smt.com\/?page_id=3919"},"modified":"2026-08-29T03:51:33","modified_gmt":"2026-08-29T11:51:33","slug":"semiconductor-packaging","status":"publish","type":"page","link":"https:\/\/dez-smt.com\/es\/industries\/semiconductor-packaging\/","title":{"rendered":"Embalaje de semiconductores"},"content":{"rendered":"\n
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Semiconductor Packaging Inspection & Rework<\/h1>\n\n\n\n
Semiconductor packages and electronic modules contain solder balls, thermal pads, lead frames and internal connections that cannot always be examined from the outside.<\/div>\n\n\n\n
DEZ X-ray systems inspect internal package structures and board-level solder connections without cutting the sample. X-ray component counters measure parts inside tape-and-reel packaging, while BGA rework stations remove and replace failed packages on assembled PCBs and modules.<\/div>\n\n\n\n
\nDiscuss Your Inspection Requirement<\/a>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n
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What DEZ Equipment Covers<\/h2>\n\n\n\n
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Semiconductor Package Inspection<\/h2>\n\n\n\n
Examine internal structural conditions and connection states inside compatible IC packages, power devices and electronic modules.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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BGA and Bottom-Terminated Package Inspection<\/h2>\n\n\n\n
Inspect solder balls and solder distribution beneath BGA, QFN, LGA, CSP and other packages after board or module assembly.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Thermal-Pad Void Inspection<\/h2>\n\n\n\n
Measure void areas and compare solder distribution beneath compatible power packages and exposed thermal pads.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Tape-and-Reel Component Counting<\/h2>\n\n\n\n
Count electronic components inside sealed reels without unwinding the carrier tape.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Package Replacement on PCB Assemblies<\/h2>\n\n\n\n
Remove, align and replace BGA, QFN, CSP, QFP, POP and other compatible surface-mounted components.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Post-Rework Inspection<\/h2>\n\n\n\n
Inspect replaced components again to check solder-ball position, bridging, voiding and solder distribution.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n<\/div><\/div>
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Explore Related Applications<\/h2>\n\n\n\n
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Solder Paste Stencil Cleaning<\/div>\n\n\n\n

Remove paste from fine apertures used for BGA, QFN and CSP board assembly.<\/p>\n<\/div>\n\n\n\n

<\/div>\n<\/div>\n<\/div>\n\n\n\n\"Pneumatic\n<\/a>\n<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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SMT Nozzle Cleaning and Maintenance<\/div>\n\n\n\n

Clean placement nozzles used to handle small semiconductor and passive components.<\/p>\n<\/div>\n\n\n\n

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X-Ray Inspection and BGA Rework<\/div>\n\n\n\n

Inspect hidden solder joints, confirm defects and replace failed bottom-terminated components.<\/p>\n<\/div>\n\n\n\n

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Reflow Soldering<\/div>\n\n\n\n

Control the heating process used to attach semiconductor packages to PCB assemblies.<\/p>\n<\/div>\n\n\n\n

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Recommended Inspection and Rework Equipment<\/h2>\n<\/div>\n\n\n\n
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View All SMT Equipment<\/span><\/span>\n <\/path>\n<\/svg><\/span><\/span><\/a><\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n