{"id":3730,"date":"2026-08-03T06:42:00","date_gmt":"2026-08-03T14:42:00","guid":{"rendered":"https:\/\/dez-smt.com\/?page_id=3730"},"modified":"2026-08-29T03:51:09","modified_gmt":"2026-08-29T11:51:09","slug":"ems-contract-electronics","status":"publish","type":"page","link":"https:\/\/dez-smt.com\/es\/industries\/ems-contract-electronics\/","title":{"rendered":"EMS y Equipos de Fabricaci\u00f3n Electr\u00f3nica por Contrato | DEZ"},"content":{"rendered":"\n
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EMS & Contract Electronics Manufacturing<\/h1>\n\n\n\n
EMS factories may process prototypes, high-mix production and repeat volume orders for different customers in the same facility. PCB dimensions, component layouts, soldering processes, fluxes and inspection requirements change between orders. Equipment must support frequent changeovers without limiting the factory to one product type.<\/div>\n\n\n\n
DEZ provides PCB and stencil cleaning, nozzle maintenance, reflow and selective soldering, PCBA cleaning, X-ray inspection, BGA rework and SMT handling equipment for contract electronics manufacturing.<\/div>\n\n\n\n
\nDiscuss Your EMS Production<\/a>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n
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EMS Manufacturing Challenges<\/h2>\n\n\n\n
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Different Customer PCBAs on Shared Equipment<\/h2>\n\n\n\n
One factory may process small control boards, large power assemblies, dense communication boards and mixed SMT\/THT products.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Frequent Product Changeovers<\/h2>\n\n\n\n
PCB width, stencil, nozzle, placement programme, reflow profile and inspection settings may change several times during one production day.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Changing Flux and Cleaning Requirements<\/h2>\n\n\n\n
Different customers may specify no-clean, water-soluble or other fluxes and require different post-solder cleaning results.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Prototype and Volume Orders<\/h2>\n\n\n\n
An equipment configuration suitable for engineering samples may not provide the cycle time required for a repeat volume order.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Customer-Specific Process Records<\/h2>\n\n\n\n
Recipes, inspection images, cleaning results and production data may need to remain separated between customer products.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Hidden Soldering Defects<\/h2>\n\n\n\n
BGA, QFN, LGA and CSP solder joints require X-ray inspection when they cannot be checked visually.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Rework Without Delaying Production<\/h2>\n\n\n\n
Defective or engineering PCBAs must be repaired without occupying the main SMT production line.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Equipment Downtime Between Orders<\/h2>\n\n\n\n
Dirty stencils, restricted nozzles and manual PCB handling increase setup time before the next product begins.<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n<\/div><\/div>
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Explore Related Applications<\/h2>\n\n\n\n
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Solder Paste Stencil Cleaning<\/div>\n\n\n\n

Clean stencils between customer orders, paste changes and production batches.<\/p>\n<\/div>\n\n\n\n

<\/div>\n<\/div>\n<\/div>\n\n\n\n\"Solder\n<\/a>\n<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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SMT Line Handling, Buffering and Transfer<\/div>\n\n\n\n

Load, transfer, inspect and unload PCBs between SMT production machines.<\/p>\n<\/div>\n\n\n\n

<\/div>\n<\/div>\n<\/div>\n\n\n\n\"SMT\n<\/a>\n<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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Selective Soldering Optimization<\/div>\n\n\n\n

Process connectors, terminals and other through-hole components on mixed SMT\/THT assemblies.<\/p>\n<\/div>\n\n\n\n

<\/div>\n<\/div>\n<\/div>\n\n\n\n\"Selective\n<\/a>\n<\/div>\n<\/div>\n <\/div><\/div>\n<\/div><\/div><\/div>\n\n\n\n
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X-Ray Inspection and BGA Rework<\/div>\n\n\n\n

Inspect hidden solder joints and replace failed components during production or engineering work.<\/p>\n<\/div>\n\n\n\n

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PCB Surface Cleaning Before Printing<\/div>\n\n\n\n

Remove dust, fibers and static from incoming bare PCBs.<\/p>\n<\/div>\n\n\n\n

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SMT Nozzle Cleaning and Maintenance<\/div>\n\n\n\n

Clean placement nozzles during product changeovers and preventive maintenance.<\/p>\n<\/div>\n\n\n\n

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Equipment for EMS Production<\/h2>\n\n\n\n
Support flexible EMS production with PCB preparation, stencil and nozzle cleaning, reflow and selective soldering, PCBA cleaning, X-ray inspection, BGA rework, and SMT line handling equipment.<\/div>\n<\/div>\n\n\n\n
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View All SMT Equipment<\/span><\/span>\n <\/path>\n<\/svg><\/span><\/span><\/a><\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n